使用0.18µm CMOS技术设计2.45GHz物联网应用的射频功率放大器

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2022-10-18 DOI:10.1108/mi-03-2022-0040
Nuha A. Rhaffor, Wei Keat Ang, Mohamed Fauzi Packeer Mohamed, J. Rajendran, N. Mohd Noh, M. T. Mustaffa, M. Hairi
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引用次数: 0

摘要

目的本研究的目的是表明,由于近年来物联网(IoT)行业的出现,对具有更高数据传输速率和更低功耗的无线通信系统的更高集成度的需求急剧增加。射频功率放大器(PA)的设计变得越来越具有挑战性和关键性。2.45的PA 使用0.18的GHz物联网应用 μm互补金属氧化物半导体(CMOS)技术。设计/方法/方法设计由两个阶段组成,驱动器和输出阶段,两者都使用单级共源晶体管配置。就性能而言,PA可以提供20多种 2.4的dB增益 GHz至2.5 GHz.Findings PA实现的最大输出功率为13.28 dBm。由于PA设计的目标是蓝牙低能耗(BLE)发射器的使用,因此至少需要10 在BLE标准中,PA传输信号需要达到dBm的输出功率。PA表现出18的恒定输出三阶拦截点 10后PA饱和前的dBm dBm输出功率。PA显示在13.24 dBm输出功率。创意/价值PA设计显示出良好的线性度,最高可达10 dBm外,PA设计显示出高达10的良好线性 dBm输出功率而不牺牲效率。工作频率为2.45 GHz时,PA表现出稳定的k因子,该值大于1;因此,PA设计被认为是无条件稳定的。此外,PA的s参数性能为–7.91 S11的dB,–11.07 S22和21.5的dB S21的dB。
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Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology
Purpose The purpose of this study is to show that due to the emergence of the Internet of Things (IoT) industry in recent years, the demand for the higher integration of wireless communication systems with a higher data rate of transmission capacity and lower power consumption has increased tremendously. The radio frequency power amplifier (PA) design is getting more challenging and crucial. A PA for a 2.45 GHz IoT application using 0.18 µm complementary metal oxide semiconductor (CMOS) technology is presented in this paper. Design/methodology/approach The design consists of two stages, the driver and output stage, where both use a single-stage common source transistor configuration. In view of performance, the PA can deliver more than 20 dB gain from 2.4 GHz to 2.5 GHz. Findings The maximum output power achieved by PA is 13.28 dBm. As the PA design is targeted for Bluetooth low energy (BLE) transmitter use, a minimum of 10 dBm output power should be achieved by PA to transmit the signal in BLE standard. The PA exhibits a constant output third-order interception point of 18 dBm before PA becomes saturated after 10 dBm output power. The PA shows a peak power added efficiency of 17.82% at the 13.24 dBm output power. Originality/value The PA design exhibits good linearity up to 10 dBm out the PA design exhibits good linearity up to 10 dBm output power without sacrificing efficiency. At the operating frequency of 2.45 GHz, the PA exhibits a stability k-factor, the value of more than 1; thus, the PA design is considered unconditional stable. Besides, the PA shows the s-parameters performance of –7.91 dB for S11, –11.07 dB for S22 and 21.5 dB for S21.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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