用管子连接的两个外壳间水分传输的数值模拟

IF 0.6 4区 工程技术 Q4 MECHANICS Mechanika Pub Date : 2022-10-21 DOI:10.5755/j02.mech.32166
Z. Staliulionis, G. Miliauskas, S. Mohanty, J. Hattel
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引用次数: 0

摘要

电子设备使用塑料或金属外壳保护。虽然,电子设备受到外壳的保护,免受周围环境的影响,但水分仍然可以通过垫圈,塑料外壳壁,电缆馈线进入外壳。由于温度变化或不同的温度水平,外壳内部存在的水分可能会凝结在PCBA或组件上,并可能导致与水分相关的故障。外壳内的温度也非常依赖于电子元件的位置和加热。此外,电子设备可以安装在复杂机械系统(如水泵或水表)的其他加热或冷却部件附近。本文研究了两个相连的冷热壳体之间复杂的瞬态传热传质过程。本文的目的是开发一个基于RC方法的内部代码,用于预测和研究两个连接的外壳内的温度和湿度行为。所建立的钢筋混凝土模型结合了一维描述和热量和质量传递的集中分析。在非等温B3 STANAG环境条件下进行了温度和湿度响应的建模。此外,还考虑了不同保温材料对保温效果的影响。
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Numerical Modelling of Moisture Transport Between Two Enclosures Connected by a Tube
The electronics is protected using plastic or metallic enclosures. Although, the electronics is protected by the enclosures from the surrounding environment, the moisture can still enter the enclosure via gasket, plastic enclosure walls, cable feedthroughs. The moisture existing inside enclosure may condense on PCBA or components due to a temperature changes or different temperature levels and can lead to a moisture-related failures. The temperature in the enclosure is also very dependent on the location and the heating of electronic components. Furthermore, the electronics can be mounted nearby to other heating or cooling components in the complex mechanical systems, such as water pump or water meter. The paper concerns the complex transient heat and mass transfer processes between two connected enclosures with one being warm and another cold. The objective of the paper is to develop an in-house code based on the RC approach for predicting and studying the temperature and moisture behaviour inside two connected enclosures. The developed RC model combines one-dimensional description and lumped analysis for heat and mass transport. The modelling of temperature and moisture response is carried out under non-isothermal B3 STANAG ambient conditions. Moreover, the effect of different material of warm enclosure and the heating are considered.
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来源期刊
Mechanika
Mechanika 物理-力学
CiteScore
1.30
自引率
0.00%
发文量
50
审稿时长
3 months
期刊介绍: The journal is publishing scientific papers dealing with the following problems: Mechanics of Solid Bodies; Mechanics of Fluids and Gases; Dynamics of Mechanical Systems; Design and Optimization of Mechanical Systems; Mechanical Technologies.
期刊最新文献
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