面向电子皮肤的柔性压力和温度传感器:材料、机制、结构和制造

Soft science Pub Date : 2023-08-07 DOI:10.20517/ss.2023.21
Shengrui Tian, Yilin Wang, Haitao Deng, Yan Wang, Xiaosheng Zhang
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引用次数: 0

摘要

电子皮肤(E-skin)由于其在物联网(IoT)、人工智能(AI)和灵活的多传感系统中的潜在应用而受到了极大的关注。电子皮肤传感装置模仿人体皮肤,可用于各种场景。触觉电子皮肤传感器中最重要的传感元件是压力和温度传感器,在过去的几十年里,它们越来越引起人们的研究兴趣。然而,由于信号干扰、复杂机制集成和结构设计等问题,先进压力和温度传感器的设计和制造可能具有挑战性。本文综述了用于电子皮肤的柔性压力和温度传感器的研究进展,主要从材料选择、机构集成、结构设计和制造方法四个方面进行了综述。全面讨论了整个传感系统中不同元件的材料,以及压力和温度传感的单一和复合机理。压力和温度传感器根据其输出电信号分为两种类型,并进行了详细的举例说明。概述了用于制造这些传感器的制造方法,包括打印方法。最后,总结了用于电子皮肤的柔性压力和温度传感器未来面临的挑战。
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Flexible pressure and temperature sensors towards e-skin: material, mechanism, structure and fabrication
Electronic skin (E-skin) has gained significant attention due to its potential applications in the Internet of Things (IoT), artificial intelligence (AI), and flexible multi-sensing systems. Mimicking human skin, e-skin sensing devices can be employed in various scenarios. Among the most important sensing elements for tactile e-skin sensors are pressure and temperature sensors, which have increasingly garnered research interest over the past few decades. However, the design and fabrication of advanced pressure and temperature sensors can be challenging owing to complications such as signal interference, complex mechanism integration, and structural design issues. This review provides an overview of flexible pressure and temperature sensors used in e-skin, covering four main perspectives: material selection, mechanism integration, structural design, and manufacturing methods. The materials of different elements in the entire sensing system are comprehensively discussed, along with single and compound mechanisms of pressure and temperature sensing. Pressure and temperature sensors are divided into two types based on their electric output signals, which are exemplified in detail. The manufacturing methods used to fabricate these sensors, including printing methods, are outlined. Lastly, a summary of the future challenges faced by flexible pressure and temperature sensors used in e-skin is presented.
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