{"title":"基于多面体低聚倍半硅氧烷交联的体侧基聚酰亚胺：降低介电常数和改善机械性能","authors":"Mengqiu Wang, Qianyu Song, Lishuai Zheng, Linxi Hou","doi":"10.1177/09540083231198882","DOIUrl":null,"url":null,"abstract":"The synthesis of a low dielectric constant polyimide (PI) with a polyhedral oligomeric silsesquioxane (POSS) cross-linked structure is presented. A non-planar conjugated diamine monomer (FSNH2) with two -CH=CH2 reactive groups was first synthesised in a two-step process, and then two polyimides were synthesized by PSS-Octavinyl (OVPOSS) substituted, FSNH2 and dianhydride. OVPOSS cross-linked polyimides have good thermal stability and low dielectric constant. 6FDA-FSNH2-OVPOSS(6FPI-3) can reach a minimum dielectric constant of 2.08 (108 Hz) and a dielectric loss of 0.008 (108 Hz). In addition, the cross-linked structure of the OVPOSS and polyimide chains prevents the agglomeration of OVPOSS to a certain extent and improves the tensile strength and elongation at break of the polyimides, which has great application potential in large-scale integrated circuits.","PeriodicalId":12932,"journal":{"name":"High Performance Polymers","volume":" ","pages":""},"PeriodicalIF":1.8000,"publicationDate":"2023-08-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Bulk side-based polyimide based on polyhedral oligomeric silsesquioxane cross-linking: Towards lower dielectric constant and better mechanical property\",\"authors\":\"Mengqiu Wang, Qianyu Song, Lishuai Zheng, Linxi Hou\",\"doi\":\"10.1177/09540083231198882\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The synthesis of a low dielectric constant polyimide (PI) with a polyhedral oligomeric silsesquioxane (POSS) cross-linked structure is presented. A non-planar conjugated diamine monomer (FSNH2) with two -CH=CH2 reactive groups was first synthesised in a two-step process, and then two polyimides were synthesized by PSS-Octavinyl (OVPOSS) substituted, FSNH2 and dianhydride. OVPOSS cross-linked polyimides have good thermal stability and low dielectric constant. 6FDA-FSNH2-OVPOSS(6FPI-3) can reach a minimum dielectric constant of 2.08 (108 Hz) and a dielectric loss of 0.008 (108 Hz). In addition, the cross-linked structure of the OVPOSS and polyimide chains prevents the agglomeration of OVPOSS to a certain extent and improves the tensile strength and elongation at break of the polyimides, which has great application potential in large-scale integrated circuits.\",\"PeriodicalId\":12932,\"journal\":{\"name\":\"High Performance Polymers\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.8000,\"publicationDate\":\"2023-08-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"High Performance Polymers\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1177/09540083231198882\",\"RegionNum\":4,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"High Performance Polymers","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1177/09540083231198882","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Bulk side-based polyimide based on polyhedral oligomeric silsesquioxane cross-linking: Towards lower dielectric constant and better mechanical property
The synthesis of a low dielectric constant polyimide (PI) with a polyhedral oligomeric silsesquioxane (POSS) cross-linked structure is presented. A non-planar conjugated diamine monomer (FSNH2) with two -CH=CH2 reactive groups was first synthesised in a two-step process, and then two polyimides were synthesized by PSS-Octavinyl (OVPOSS) substituted, FSNH2 and dianhydride. OVPOSS cross-linked polyimides have good thermal stability and low dielectric constant. 6FDA-FSNH2-OVPOSS(6FPI-3) can reach a minimum dielectric constant of 2.08 (108 Hz) and a dielectric loss of 0.008 (108 Hz). In addition, the cross-linked structure of the OVPOSS and polyimide chains prevents the agglomeration of OVPOSS to a certain extent and improves the tensile strength and elongation at break of the polyimides, which has great application potential in large-scale integrated circuits.
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Health Services Management Research (HSMR) is an authoritative international peer-reviewed journal which publishes theoretically and empirically rigorous research on questions of enduring interest to health-care organizations and systems throughout the world. Examining the real issues confronting health services management, it provides an independent view and cutting edge evidence-based research to guide policy-making and management decision-making. HSMR aims to be a forum serving an international community of academics and researchers on the one hand and healthcare managers, executives, policymakers and clinicians and all health professionals on the other. HSMR wants to make a substantial contribution to both research and managerial practice, with particular emphasis placed on publishing studies which offer actionable findings and on promoting knowledge mobilisation toward theoretical advances. All papers are expected to be of interest and relevance to an international audience. HSMR aims at enhance communication between academics and practitioners concerned with developing, implementing, and analysing health management issues, reforms and innovations primarily in European health systems and in all countries with developed health systems. Papers can report research undertaken in a single country, but they need to locate and explain their findings in an international context, and in international literature.
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