各向异性导电浆料的制备及其在FOB互连中的应用

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2023-02-17 DOI:10.1108/mi-11-2022-0187

Xiong-hui Cai, A. Zhai, Chenglong Zhou, K. Paik

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引用次数: 0

摘要

目的研究将镍球分散在环氧树脂固化体系中制备的各向异性导电膏（ACP）连接柔性板上（FOB）互连的可靠性。设计/方法/方法差示扫描量热法用于评估糊状物的固化特性。在高温高湿试验（85°C，85%湿度）、热循环（−45°C～125°C，30min/循环）和压力锅试验（PCT，121°C，100%湿度2 atm）来评估船上柔性（FOB）互连可靠性。调查发现，FOB测试车辆首次使用ACP成功粘合。FOB的ACP连接接头具有良好的可靠性，可以满足FOB互连的要求。与传统的各向异性导电膜（ACF）相比，这种ACP互连为FOB互连提供了更高的粘附强度、更高的接头载流能力以及更高的可靠性性能和更低的成本。独创性/价值ACP应用于FOB的互连。与传统ACF相比，它具有更高的可靠性和更低的成本。

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The preparation of anisotropic conductive paste and its application in FOB interconnection

Purpose The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system. Design/methodology/approach Differential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90º peel adhesion were tested before and after high temperature and high humidity test (85°C, 85% humidity), thermal cycling (−45°C∼125°C, 30min/cycle) and pressure cooker test (PCT, 121°C, 100% humidity 2 atm) to evaluate the flex on board (FOB) interconnection reliability. Findings It is found that FOB test vehicles have been successfully bonded by using ACP for the first time. And the ACP bonding joint of FOB has good reliability and can meet the requirements of FOB interconnection. Compared with conventional anisotropic conductive film (ACF), this ACP interconnection provides higher adhesion strength, higher joint current carrying capability and higher reliability performance and lower cost for FOB interconnection. Originality/value ACP is applied in the interconnection of FOB. It has the higher reliability performance and lower cost for than the conventional ACF.

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来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.