初步的电泳研究:白蛋白的操作和循环伏安技术的电定量

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2021-09-05 DOI:10.1108/mi-02-2021-0026
Nur Shahira Abdul Nasir, Revathy Deivasigamani, Muhammad Khairulanwar Abdul Rahim, Siti Nur AshakirinMohd Nashruddin, A. A. Hamzah, M. R. Wee, M. R. Buyong
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引用次数: 2

摘要

目的:本文的目的是可视化的蛋白质操作使用电介质电泳(DEP)作为一个有效的蛋白质分析和生物传感器方法的实质性观点,因为DEP能够用作操作,分馏,预浓缩和分离的手段。这项研究的目的是使用一种称为循环伏安法(CV)的电化学技术来量化DEP,因为白蛋白在没有任何荧光探针或染料的情况下是不可见的。DEP的原理是通过在锥形DEP微电极上施加电场产生的。在丝网印刷的碳电极上使用不同浓度的白蛋白,分析了CV的原理。利用DEP和CV方法的初步数据作为两种技术集成的未来前景,以进行DEP力的电量化。结果白蛋白的大小为0.027µm。选择尺寸为0.05µm的工程聚苯乙烯颗粒来模拟白蛋白的DEP驱动。样品工程聚苯乙烯颗粒的正DEP能够在10 MHz和20 Vpp下清晰地显示。然而,由于仪器的限制,负DEP无法显示。然而,由于白蛋白的半透明性质,在荧光显微镜下无法看到。因此,使用了一种称为CV技术的电量化方法。用CV法检测牛血清白蛋白(BSA)是成功的。随着BSA浓度的增加,从伏安图中得到的峰值电流减小。峰值电流可以作为DEP响应的一个指标,因为它与蛋白质在电极上的吸附有关。CV和DEP结果的重要性表明,两种技术的整合是可能的。两种方法的整合可以产生一种新的精确技术,用于肾血液透析治疗的透析器中,用于蛋白质白蛋白的操作和传感。
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Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique
Purpose The purpose of this paper is to visualize protein manipulation using dielectrophoresis (DEP) as a substantial perspective on being an effective protein analysis and biosensor method as DEP is able to be used as a means for manipulation, fractionation, pre-concentration and separation. This research aims to quantify DEP using an electrochemical technique known as cyclic voltammetry (CV), as albumin is non-visible without any fluorescent probe or dye. Design/methodology/approach The principles of DEP were generated by an electric field on tapered DEP microelectrodes. The principle of CV was analysed using different concentrations of albumin on a screen-printed carbon electrode. Using preliminary data from both DEP and CV methods as a future prospect for the integration of both techniques to do electrical quantification of DEP forces. Findings The size of the albumin is known to be 0.027 µm. Engineered polystyrene particle of size 0.05 µm was selected to mimic the DEP actuation of albumin. Positive DEP of the sample engineered polystyrene particle was able to be visualized clearly at 10 MHz supplied with 20 Vpp. However, negative DEP was not able to be visualized because of the limitation of the apparatus. However, albumin was not able to be visualized under the fluorescent microscope because of its translucent properties. Thus, a method of electrical quantification known as the CV technique is used. The detection of bovine serum albumin (BSA) using the CV method is successful. As the concentration of BSA increases, the peak current obtained from the voltammogram decreases. The peak current can be an indicator of DEP response as it correlates to the adsorption of the protein onto the electrodes. The importance of the results from both CV and DEP shows that the integration of both techniques is possible. Originality/value The integration of both methods could give rise to a new technique with precision to be implemented into the dialyzers used in renal haemodialysis treatment for manipulation and sensing of protein albumin.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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