壁厚对ka波段te21模耦合器宽带设计的影响

Q1 Engineering Journal of Electronic Science and Technology Pub Date : 2021-12-01 DOI:10.1016/j.jnlest.2021.100137

Wei Zheng, Chao Wang, Wen-Li Yang, Chun-Bang Wu

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引用次数: 0

摘要

通常，经典的te21模耦合器设计公式由于忽略壁厚，只适用于ka波段下的工作频率。然而，在实际应用的ka波段以外的te21模耦合器设计中，新公式需要考虑壁厚的影响。在此，我们通过计算机模拟展示了一个超越ka波段的te21模式耦合器的设计测量，并考虑了壁厚。实验结果表明，对耦合孔尺寸采用线性二次加权和的方法可以提高耦合性能。令人惊讶的是，这种耦合器显示10%的带宽，耦合损耗小于0.5 dB，隔离度超过40 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effect of wall thickness on broadband design of a Ka-band TE21-mode coupler

Commonly, the classical formulas for designing TE₂₁-mode coupler are suitable for the operating frequency under Ka-band by virtue of ignoring wall thickness. However, in real application of TE₂₁-mode coupler design beyond Ka-band, the new formulas need to consider the effect of wall thickness. Herein, we demonstrate a design measure of a TE₂₁-mode coupler beyond Ka-band via computer simulation, giving attention to wall thickness. The experimental results show that a measure of linear second weighted sum for coupling hole size could improve coupler performance. Amazingly, such coupler shows 10% bandwidth with less than 0.5 dB coupling loss and more than 40 dB isolation is possible.

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来源期刊

Journal of Electronic Science and Technology Engineering-Electrical and Electronic Engineering

CiteScore

4.30

自引率

0.00%

发文量

1362

审稿时长

99 days

期刊介绍： JEST (International) covers the state-of-the-art achievements in electronic science and technology, including the most highlight areas: ¨ Communication Technology ¨ Computer Science and Information Technology ¨ Information and Network Security ¨ Bioelectronics and Biomedicine ¨ Neural Networks and Intelligent Systems ¨ Electronic Systems and Array Processing ¨ Optoelectronic and Photonic Technologies ¨ Electronic Materials and Devices ¨ Sensing and Measurement ¨ Signal Processing and Image Processing JEST (International) is dedicated to building an open, high-level academic journal supported by researchers, professionals, and academicians. The Journal has been fully indexed by Ei INSPEC and has published, with great honor, the contributions from more than 20 countries and regions in the world.