考虑热应力的全桥功率变换器SRG可靠性评估

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2023-05-03 DOI:10.1108/mi-06-2022-0094
Fan Yang, Hao Chen, Shuai Xu
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引用次数: 0

摘要

目的定量可靠性分析可以有效地确定驱动系统需要维护的时间。然后,可以发现潜在的安全问题,并有效地防止一些灾难性故障。因此,本文旨在评估开关磁阻发电机(SRG)驱动系统的可靠性。设计/方法/途径本文提出了一种考虑不同热应力和容错能力的SRG可靠性分析方法。采用全桥功率变换器(FBPC)代替非对称半桥功率转换器(AHBPC)来驱动SRG系统。首先,介绍了SRG系统的主要故障模式,并提出了判断系统是否失效的故障准则。其次,建立了转换器的热回路模型,快速准确地获得器件的结温。最后,建立了不同层次的马尔可夫模型来评价系统的可靠性。结果表明,与静态模型和一级马尔可夫模型相比,二级马尔可夫模型是最合适的。独创性/价值通过马尔可夫模型评估系统的可靠性后,SRG的驱动系统将更加可靠。同时,采用FBPC驱动SRG。FBPC具有开关器件少、集成度高、成本低的优点。所提出的FBPC驱动策略避免了电流反向和死区时间的产生,具有运行可靠的优点。此外,还提出了一个精确的FBPC热电路模型,并可以分别获得每个器件的结温。
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Reliability evaluation on SRG with full-bridge power converter considering thermal stress
Purpose Quantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate the reliability of the switched reluctance generator (SRG) driving system. Design/methodology/approach In this paper, a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of an SRG. A full-bridge power converter (FBPC) instead of the asymmetric half-bridge power converter (AHBPC) is adopted to drive the SRG system. First, the primary fault modes of the SRG system are introduced, and a fault criterion is proposed to determine whether the system fails. Second, the thermal circuit model of the converter is established to quickly and accurately obtain the junction temperature of the devices. At last, the Markov models of different levels are established to evaluate the reliability of the system. Findings The results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model. Originality/value The driving system of SRG will be more reliable after the reliability of the system is evaluated by the Markov model. At the same time, an FBPC is adopted to drive the SRG. The FBPCs have the advantages of fewer switching devices, higher integration and lower cost. The proposed driving strategy of the FBPC avoids the current reversal and the generation of dead zone time, which has the advantage of reliable operation. In addition, a precise thermal circuit model of the FBPC is proposed, and the junction temperature of each device can be obtained, respectively.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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