{"title":"考虑热应力的全桥功率变换器SRG可靠性评估","authors":"Fan Yang, Hao Chen, Shuai Xu","doi":"10.1108/mi-06-2022-0094","DOIUrl":null,"url":null,"abstract":"\nPurpose\nQuantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate the reliability of the switched reluctance generator (SRG) driving system.\n\n\nDesign/methodology/approach\nIn this paper, a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of an SRG. A full-bridge power converter (FBPC) instead of the asymmetric half-bridge power converter (AHBPC) is adopted to drive the SRG system. First, the primary fault modes of the SRG system are introduced, and a fault criterion is proposed to determine whether the system fails. Second, the thermal circuit model of the converter is established to quickly and accurately obtain the junction temperature of the devices. At last, the Markov models of different levels are established to evaluate the reliability of the system.\n\n\nFindings\nThe results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model.\n\n\nOriginality/value\nThe driving system of SRG will be more reliable after the reliability of the system is evaluated by the Markov model. At the same time, an FBPC is adopted to drive the SRG. The FBPCs have the advantages of fewer switching devices, higher integration and lower cost. The proposed driving strategy of the FBPC avoids the current reversal and the generation of dead zone time, which has the advantage of reliable operation. In addition, a precise thermal circuit model of the FBPC is proposed, and the junction temperature of each device can be obtained, respectively.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2023-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reliability evaluation on SRG with full-bridge power converter considering thermal stress\",\"authors\":\"Fan Yang, Hao Chen, Shuai Xu\",\"doi\":\"10.1108/mi-06-2022-0094\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nQuantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate the reliability of the switched reluctance generator (SRG) driving system.\\n\\n\\nDesign/methodology/approach\\nIn this paper, a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of an SRG. A full-bridge power converter (FBPC) instead of the asymmetric half-bridge power converter (AHBPC) is adopted to drive the SRG system. First, the primary fault modes of the SRG system are introduced, and a fault criterion is proposed to determine whether the system fails. Second, the thermal circuit model of the converter is established to quickly and accurately obtain the junction temperature of the devices. At last, the Markov models of different levels are established to evaluate the reliability of the system.\\n\\n\\nFindings\\nThe results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model.\\n\\n\\nOriginality/value\\nThe driving system of SRG will be more reliable after the reliability of the system is evaluated by the Markov model. At the same time, an FBPC is adopted to drive the SRG. The FBPCs have the advantages of fewer switching devices, higher integration and lower cost. The proposed driving strategy of the FBPC avoids the current reversal and the generation of dead zone time, which has the advantage of reliable operation. In addition, a precise thermal circuit model of the FBPC is proposed, and the junction temperature of each device can be obtained, respectively.\\n\",\"PeriodicalId\":49817,\"journal\":{\"name\":\"Microelectronics International\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2023-05-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics International\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/mi-06-2022-0094\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-06-2022-0094","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Reliability evaluation on SRG with full-bridge power converter considering thermal stress
Purpose
Quantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate the reliability of the switched reluctance generator (SRG) driving system.
Design/methodology/approach
In this paper, a method considering different thermal stresses and fault tolerance capacity is proposed to analyze the reliability of an SRG. A full-bridge power converter (FBPC) instead of the asymmetric half-bridge power converter (AHBPC) is adopted to drive the SRG system. First, the primary fault modes of the SRG system are introduced, and a fault criterion is proposed to determine whether the system fails. Second, the thermal circuit model of the converter is established to quickly and accurately obtain the junction temperature of the devices. At last, the Markov models of different levels are established to evaluate the reliability of the system.
Findings
The results show that the two-level Markov model is the most suitable when compared to the static model and the one-level Markov model.
Originality/value
The driving system of SRG will be more reliable after the reliability of the system is evaluated by the Markov model. At the same time, an FBPC is adopted to drive the SRG. The FBPCs have the advantages of fewer switching devices, higher integration and lower cost. The proposed driving strategy of the FBPC avoids the current reversal and the generation of dead zone time, which has the advantage of reliable operation. In addition, a precise thermal circuit model of the FBPC is proposed, and the junction temperature of each device can be obtained, respectively.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.