不同结构参数的垂直e型Ga2O3 MOSFET击穿研究

IF 0.6 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Nanoelectronics and Optoelectronics Pub Date : 2023-04-01 DOI:10.1166/jno.2023.3403
Xuanlin Li, Weijing Liu, Qinghua Li
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引用次数: 0

摘要

为了控制增强型(E型)Ga2O3 MOSFET的漏极诱导势垒降低(DIBL)和过早击穿,系统地研究了结构和工艺参数对击穿电压(VBK)和DIBL的影响。结果表明,小的栅极功函数、小的氧化物介电常数、厚的氧化物厚度、外延层的过度掺杂浓度以及宽和短的沟道将导致严重的DIBL效应,导致器件过早击穿。另一方面,漂移区的厚度对DIBL具有边际影响,并且在排除了产生强DIBL效应的其他结构参数之后,漂移区厚度的合理增加有利于提高器件的VBK。该研究有助于在具有高VBK可靠性要求的应用场景中设计Ga2O3 MOSFET。
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Investigation of Breakdown in Vertical E-Mode Ga2O3 MOSFET with Different Structural Parameters
In order to control drain-induced barrier lowering (DIBL) and thus premature breakdown in enhancement-mode (E-mode) Ga2O3 MOSFETs, the effect of structure and process parameters on the breakdown voltage (VBK) and DIBL is systematically investigated. The results show that the small gate work function, the small oxide dielectric constant, the thick oxide thickness, the excessive doping concentration of the epitaxial layer, and the wide and short channel will lead to a severe DIBL effect, causing the device to breakdown prematurely. On the other hand, the thickness of the drift region has a marginal effect on the DIBL, and after excluding other structural parameters that generate a strong DIBL effect, a reasonable increase in the thickness of the drift region is beneficial to improve the VBK of devices. This study can contribute to the design of Ga2O3 MOSFETs in the application scenario with high VBK reliability requirements.
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来源期刊
Journal of Nanoelectronics and Optoelectronics
Journal of Nanoelectronics and Optoelectronics 工程技术-工程:电子与电气
自引率
16.70%
发文量
48
审稿时长
12.5 months
期刊最新文献
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