基于纳米尺度量子点元胞自动机的数字比较器容错设计

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2021-08-16 DOI:10.1108/mi-01-2021-0006
Wenhua Huang, Juan Ren, Jinglong Jiang, J. Cheng
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引用次数: 3

摘要

目的量子点细胞自动机(QCA)是一种新的纳米级无晶体管计算模型。为了解决互补金属氧化物半导体技术的规模限制,QCA试图在纳米尺度上产生在尺寸、开关速度、能量和容错方面具有更好结果的通用计算。目前,这项技术根据化学分子中电子排列的分布来解释二进制信息。在容错数字比较器的设计中使用共面拓扑可以提高比较器的性能。本文旨在提出QCA中基于多数和反相器门的容错数字比较器的共面设计。设计/方法/方法由于数字比较器是必不可少的数字电路之一,在本研究中,提出了一种新的基于QCA的数字比较器容错结构。所提出的共面设计是使用共面反相器和多数门来实现的。QCADesigner2.0.3模拟器用于模拟所提出的新型容错共面数字比较器。发现QCADesigner 2.0.3中评估和分析了四个元素,包括单元错位、单元缺失、额外单元和单元错位。研究结果表明,所构建电路的逻辑函数是准确的。在存在单个遗漏缺陷的情况下,这种容错数字比较器架构将实现100%的容错。此外,该比较器在单单元位移故障下具有90%以上的容错性,在单单元缺失故障下具有95%以上的容错率。独创性/价值利用共面多数和反相器,提出了QCA技术中容错数字比较器的一种新结构。此外,性能指标和获得的结果表明,共面设计可以用于QCA电路,以产生优化的容错电路。
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A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata
Purpose Quantum-dot Cellular Automata (QCA) is a new nano-scale transistor-less computing model. To address the scaling limitations of complementary-metal-oxide-semiconductor technology, QCA seeks to produce general computation with better results in terms of size, switching speed, energy and fault-tolerant at the nano-scale. Currently, binary information is interpreted in this technology, relying on the distribution of the arrangement of electrons in chemical molecules. Using the coplanar topology in the design of a fault-tolerant digital comparator can improve the comparator’s performance. This paper aims to present the coplanar design of a fault-tolerant digital comparator based on the majority and inverter gate in the QCA. Design/methodology/approach As the digital comparator is one of the essential digital circuits, in the present study, a new fault-tolerant architecture is proposed for a digital comparator based on QCA. The proposed coplanar design is realized using coplanar inverters and majority gates. The QCADesigner 2.0.3 simulator is used to simulate the suggested new fault-tolerant coplanar digital comparator. Findings Four elements, including cell misalignment, cell missing, extra cell and cell dislocation, are evaluated and analyzed in QCADesigner 2.0.3. The outcomes of the study demonstrate that the logical function of the built circuit is accurate. In the presence of a single missed defect, this fault-tolerant digital comparator architecture will achieve 100% fault tolerance. Also, this comparator is above 90% fault-tolerant under single-cell displacement faults and is above 95% fault-tolerant under single-cell missing defects. Originality/value A novel structure for the fault-tolerant digital comparator in the QCA technology was proposed used by coplanar majority and inverter. Also, the performance metrics and obtained results establish that the coplanar design can be used in the QCA circuits to produce optimized and fault-tolerant circuits.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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