Muhammad Ahmad Raza Tahir, M. M. Saleem, Syed Ali Asadullah Bukhari, Amir Hamza, R. I. Shakoor
{"title":"考虑微加工工艺限制和操作环境变化的双轴MEMS加速度计的高效设计","authors":"Muhammad Ahmad Raza Tahir, M. M. Saleem, Syed Ali Asadullah Bukhari, Amir Hamza, R. I. Shakoor","doi":"10.1108/mi-02-2021-0023","DOIUrl":null,"url":null,"abstract":"\nPurposeThis paper aims to present an efficient design approach for the micro electromechanical systems (MEMS) accelerometers considering design parameters affecting the long-term reliability of these inertial sensors in comparison to traditional iterative microfabrication and experimental characterization approach.\n\n\nDesign/methodology/approachA dual-axis capacitive MEMS accelerometer design is presented considering the microfabrication process constraints of the foundry process. The performance of the MEMS accelerometer is analyzed through finite element method– based simulations considering main design parameters affecting the long-term reliability. The effect of microfabrication process induced residual stress, operating pressure variations in the range of 10 mTorr to atmospheric pressure, thermal variations in the operating temperature range of −40°C to 100°C and impulsive input acceleration at different input frequency values is presented in detail.\n\n\nFindingsThe effect of residual stress is negligible on performance of the MEMS accelerometer due to efficient design of mechanical suspension beams. The effect of operating temperature and pressure variations is negligible on energy loss factor. The thermal strain at high temperature causes the sensing plates to deform out of plane. The input dynamic acceleration range is 34 g at room temperature, which decreases with operating temperature variations. At low frequency input acceleration, the input acts as a quasi-static load, whereas at high frequency, it acts as a dynamic load for the MEMS accelerometer.\n\n\nOriginality/valueIn comparison with the traditional MEMS accelerometer design approaches, the proposed design approach focuses on the analysis of critical design parameters that affect the long-term reliability of MEMS accelerometer.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2021-08-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations\",\"authors\":\"Muhammad Ahmad Raza Tahir, M. M. Saleem, Syed Ali Asadullah Bukhari, Amir Hamza, R. I. Shakoor\",\"doi\":\"10.1108/mi-02-2021-0023\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurposeThis paper aims to present an efficient design approach for the micro electromechanical systems (MEMS) accelerometers considering design parameters affecting the long-term reliability of these inertial sensors in comparison to traditional iterative microfabrication and experimental characterization approach.\\n\\n\\nDesign/methodology/approachA dual-axis capacitive MEMS accelerometer design is presented considering the microfabrication process constraints of the foundry process. The performance of the MEMS accelerometer is analyzed through finite element method– based simulations considering main design parameters affecting the long-term reliability. The effect of microfabrication process induced residual stress, operating pressure variations in the range of 10 mTorr to atmospheric pressure, thermal variations in the operating temperature range of −40°C to 100°C and impulsive input acceleration at different input frequency values is presented in detail.\\n\\n\\nFindingsThe effect of residual stress is negligible on performance of the MEMS accelerometer due to efficient design of mechanical suspension beams. The effect of operating temperature and pressure variations is negligible on energy loss factor. The thermal strain at high temperature causes the sensing plates to deform out of plane. The input dynamic acceleration range is 34 g at room temperature, which decreases with operating temperature variations. At low frequency input acceleration, the input acts as a quasi-static load, whereas at high frequency, it acts as a dynamic load for the MEMS accelerometer.\\n\\n\\nOriginality/valueIn comparison with the traditional MEMS accelerometer design approaches, the proposed design approach focuses on the analysis of critical design parameters that affect the long-term reliability of MEMS accelerometer.\\n\",\"PeriodicalId\":49817,\"journal\":{\"name\":\"Microelectronics International\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2021-08-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics International\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/mi-02-2021-0023\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-02-2021-0023","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations
PurposeThis paper aims to present an efficient design approach for the micro electromechanical systems (MEMS) accelerometers considering design parameters affecting the long-term reliability of these inertial sensors in comparison to traditional iterative microfabrication and experimental characterization approach.
Design/methodology/approachA dual-axis capacitive MEMS accelerometer design is presented considering the microfabrication process constraints of the foundry process. The performance of the MEMS accelerometer is analyzed through finite element method– based simulations considering main design parameters affecting the long-term reliability. The effect of microfabrication process induced residual stress, operating pressure variations in the range of 10 mTorr to atmospheric pressure, thermal variations in the operating temperature range of −40°C to 100°C and impulsive input acceleration at different input frequency values is presented in detail.
FindingsThe effect of residual stress is negligible on performance of the MEMS accelerometer due to efficient design of mechanical suspension beams. The effect of operating temperature and pressure variations is negligible on energy loss factor. The thermal strain at high temperature causes the sensing plates to deform out of plane. The input dynamic acceleration range is 34 g at room temperature, which decreases with operating temperature variations. At low frequency input acceleration, the input acts as a quasi-static load, whereas at high frequency, it acts as a dynamic load for the MEMS accelerometer.
Originality/valueIn comparison with the traditional MEMS accelerometer design approaches, the proposed design approach focuses on the analysis of critical design parameters that affect the long-term reliability of MEMS accelerometer.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.