具有超低介电常数和隔热性能的刚性/柔性分子结构诱导聚酰亚胺气凝胶

IF 3.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IET Nanodielectrics Pub Date : 2022-12-19 DOI:10.1049/nde2.12041
Xiaodi Dong, Baoquan Wan, Lin Qiu, Ming-Sheng Zheng, Jiefeng Gao, Jun-Wei Zha
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引用次数: 2

摘要

利用冷冻干燥技术成功合成了一系列具有不同分子结构的高性能线性和交联聚酰亚胺(PI)气凝胶。在本研究中,通过控制聚合单体的刚性/柔性结构和组成,实现了PI气凝胶的微观结构、热力学、隔热和介电性能的综合调控。PI分子结构刚度的提高可以促进致密孔隙的形成,有利于提高气凝胶的热力学和保温性能。值得注意的是,在线性PI中引入交联剂(三(4-氨基苯基)胺,[TPA])制备的交联PI气凝胶具有很高的热稳定性(Td5% >优异的超低介电常数(εr = 1.31, f = 106 Hz)和良好的保温性能(k = 0.056 W/m·k),这一创新策略促进了交联聚酰亚胺气凝胶在集成电路和航天探索领域的更广泛应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Rigid/flexible molecular structure-induced polyimide aerogels with ultralow permittivity and thermal insulation properties

A series of high-performance linear and cross-linked polyimide (PI) aerogels with different molecular structures have been successfully synthesised using the freeze-drying process. In this study, the comprehensive regulation of microstructure, thermodynamic, thermal insulation and dielectric properties of PI aerogels are achieved by controlling the rigid/flexible structure and composition of polymerised monomers. The increase in rigidity of PI molecular structure could promote the formation of denser pores, which is beneficial to improve the thermodynamic and thermal insulation properties of aerogels. Notably, the cross-linked PI aerogel prepared by introducing cross-linking agent (tris(4-aminophenyl) amine, [TPA]) into linear PI exhibits high thermal stability (Td5% > 560°C), excellent ultralow permittivity (εr = 1.31, f = 106 Hz) and good thermal insulation property (k = 0.056 W/m · K). This innovative strategy promotes the wider application of the cross-linked polyimide aerogel in the field of integrated circuits and aerospace exploration.

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来源期刊
IET Nanodielectrics
IET Nanodielectrics Materials Science-Materials Chemistry
CiteScore
5.60
自引率
3.70%
发文量
7
审稿时长
21 weeks
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