{"title":"从屈服应力角度阐释木材夹层压缩的机理","authors":"Rongfeng Huang, S. Feng, Zhiqiang Gao, H. Liu","doi":"10.1515/hf-2023-0002","DOIUrl":null,"url":null,"abstract":"Abstract To elucidate the mechanism of wood sandwich compression, the response of wood compressing yield stress to hygrothermal conditions was investigated in this study with respect to preheating temperature (30–210 °C) and moisture content (MC, 0–100 %). An associated functional model was developed to predict wood yield stress based on the measured MC and temperature in wood. A 1 % increase in wood MC or a 10 °C increase of temperature led to a decrease in wood yield stress exceeding 0.1 MPa. Significant variations in yield stress, exceeding 0.8 MPa, were observed between high MC layer(s) and the remaining layer(s) along the wood thickness when there was an MC variation over 5 %. Preheating the wood with by heating platens accelerated water/moisture migration in wood, resulting in relatively low yield stress in the wood interior areas where water/moisture had migrated. This study demonstrated that the comparatively low yield stress of some wood areas was responsible for sandwich compression. When mechanically compressed, only the wood layer(s) with lower yield stress was compressed, leading to sandwich compression, regardless of whether the mechanical force was applied tangentially or radially.","PeriodicalId":13083,"journal":{"name":"Holzforschung","volume":"77 1","pages":"629 - 639"},"PeriodicalIF":2.2000,"publicationDate":"2023-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mechanism elucidation for wood sandwich compression from the perspective of yield stress\",\"authors\":\"Rongfeng Huang, S. Feng, Zhiqiang Gao, H. Liu\",\"doi\":\"10.1515/hf-2023-0002\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract To elucidate the mechanism of wood sandwich compression, the response of wood compressing yield stress to hygrothermal conditions was investigated in this study with respect to preheating temperature (30–210 °C) and moisture content (MC, 0–100 %). An associated functional model was developed to predict wood yield stress based on the measured MC and temperature in wood. A 1 % increase in wood MC or a 10 °C increase of temperature led to a decrease in wood yield stress exceeding 0.1 MPa. Significant variations in yield stress, exceeding 0.8 MPa, were observed between high MC layer(s) and the remaining layer(s) along the wood thickness when there was an MC variation over 5 %. Preheating the wood with by heating platens accelerated water/moisture migration in wood, resulting in relatively low yield stress in the wood interior areas where water/moisture had migrated. This study demonstrated that the comparatively low yield stress of some wood areas was responsible for sandwich compression. When mechanically compressed, only the wood layer(s) with lower yield stress was compressed, leading to sandwich compression, regardless of whether the mechanical force was applied tangentially or radially.\",\"PeriodicalId\":13083,\"journal\":{\"name\":\"Holzforschung\",\"volume\":\"77 1\",\"pages\":\"629 - 639\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2023-06-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Holzforschung\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1515/hf-2023-0002\",\"RegionNum\":3,\"RegionCategory\":\"农林科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"FORESTRY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Holzforschung","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1515/hf-2023-0002","RegionNum":3,"RegionCategory":"农林科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"FORESTRY","Score":null,"Total":0}
Mechanism elucidation for wood sandwich compression from the perspective of yield stress
Abstract To elucidate the mechanism of wood sandwich compression, the response of wood compressing yield stress to hygrothermal conditions was investigated in this study with respect to preheating temperature (30–210 °C) and moisture content (MC, 0–100 %). An associated functional model was developed to predict wood yield stress based on the measured MC and temperature in wood. A 1 % increase in wood MC or a 10 °C increase of temperature led to a decrease in wood yield stress exceeding 0.1 MPa. Significant variations in yield stress, exceeding 0.8 MPa, were observed between high MC layer(s) and the remaining layer(s) along the wood thickness when there was an MC variation over 5 %. Preheating the wood with by heating platens accelerated water/moisture migration in wood, resulting in relatively low yield stress in the wood interior areas where water/moisture had migrated. This study demonstrated that the comparatively low yield stress of some wood areas was responsible for sandwich compression. When mechanically compressed, only the wood layer(s) with lower yield stress was compressed, leading to sandwich compression, regardless of whether the mechanical force was applied tangentially or radially.
期刊介绍:
Holzforschung is an international scholarly journal that publishes cutting-edge research on the biology, chemistry, physics and technology of wood and wood components. High quality papers about biotechnology and tree genetics are also welcome. Rated year after year as one of the top scientific journals in the category of Pulp and Paper (ISI Journal Citation Index), Holzforschung represents innovative, high quality basic and applied research. The German title reflects the journal''s origins in a long scientific tradition, but all articles are published in English to stimulate and promote cooperation between experts all over the world. Ahead-of-print publishing ensures fastest possible knowledge transfer.