{"title":"一种超宽带Koch分形贴片天线","authors":"Iqra Masroor, J. A. Ansari","doi":"10.1108/mi-12-2022-0201","DOIUrl":null,"url":null,"abstract":"\nPurpose\nCompact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of operating frequencies. The purpose of this paper is to propose a novel compact and ultrawideband (UWB) microstrip patch antenna intended for high frequency wireless applications.\n\n\nDesign/methodology/approach\nA square microstrip patch antenna was initially modeled on finite element method-based electromagnetic simulation tool high frequency structure simulator. It was then loaded with a rectangular slit and Koch snowflake-shaped fractal notches for bandwidth enhancement. The fabricated prototype was tested by using vector network analyzer from Agilent Technologies, N5247A, Santa Clara, California, United States (US).\n\n\nFindings\nThe designed Koch fractal patch antenna is highly compact with dimensions of 10 × 10 mm only and possesses UWB characteristics with multiple resonances in the operating band. The −10 dB measured impedance bandwidth was observed to be approximately 13.65 GHz in the frequency range (23.20–36.85 GHz).\n\n\nOriginality/value\nOwing to its simple and compact structure, positive and substantial gain values, high radiation efficiency and stable radiation patterns throughout the frequency band of interest, the proposed antenna is a suitable candidate for high frequency wireless applications in the K (18–27 GHz) and Ka (26.5–40 GHz) microwave bands.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2023-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An ultrawideband Koch fractal patch antenna\",\"authors\":\"Iqra Masroor, J. A. Ansari\",\"doi\":\"10.1108/mi-12-2022-0201\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nCompact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of operating frequencies. The purpose of this paper is to propose a novel compact and ultrawideband (UWB) microstrip patch antenna intended for high frequency wireless applications.\\n\\n\\nDesign/methodology/approach\\nA square microstrip patch antenna was initially modeled on finite element method-based electromagnetic simulation tool high frequency structure simulator. It was then loaded with a rectangular slit and Koch snowflake-shaped fractal notches for bandwidth enhancement. The fabricated prototype was tested by using vector network analyzer from Agilent Technologies, N5247A, Santa Clara, California, United States (US).\\n\\n\\nFindings\\nThe designed Koch fractal patch antenna is highly compact with dimensions of 10 × 10 mm only and possesses UWB characteristics with multiple resonances in the operating band. The −10 dB measured impedance bandwidth was observed to be approximately 13.65 GHz in the frequency range (23.20–36.85 GHz).\\n\\n\\nOriginality/value\\nOwing to its simple and compact structure, positive and substantial gain values, high radiation efficiency and stable radiation patterns throughout the frequency band of interest, the proposed antenna is a suitable candidate for high frequency wireless applications in the K (18–27 GHz) and Ka (26.5–40 GHz) microwave bands.\\n\",\"PeriodicalId\":49817,\"journal\":{\"name\":\"Microelectronics International\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2023-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics International\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/mi-12-2022-0201\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-12-2022-0201","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Purpose
Compact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of operating frequencies. The purpose of this paper is to propose a novel compact and ultrawideband (UWB) microstrip patch antenna intended for high frequency wireless applications.
Design/methodology/approach
A square microstrip patch antenna was initially modeled on finite element method-based electromagnetic simulation tool high frequency structure simulator. It was then loaded with a rectangular slit and Koch snowflake-shaped fractal notches for bandwidth enhancement. The fabricated prototype was tested by using vector network analyzer from Agilent Technologies, N5247A, Santa Clara, California, United States (US).
Findings
The designed Koch fractal patch antenna is highly compact with dimensions of 10 × 10 mm only and possesses UWB characteristics with multiple resonances in the operating band. The −10 dB measured impedance bandwidth was observed to be approximately 13.65 GHz in the frequency range (23.20–36.85 GHz).
Originality/value
Owing to its simple and compact structure, positive and substantial gain values, high radiation efficiency and stable radiation patterns throughout the frequency band of interest, the proposed antenna is a suitable candidate for high frequency wireless applications in the K (18–27 GHz) and Ka (26.5–40 GHz) microwave bands.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.