M. Faheem, Muhammad Basit Azeem, A. A. Minhas, Shun'an Zhong, Xinghua Wang
{"title":"4G/LTE超低功耗ADC和小型化射频收发电路关键技术","authors":"M. Faheem, Muhammad Basit Azeem, A. A. Minhas, Shun'an Zhong, Xinghua Wang","doi":"10.1108/mi-06-2021-0054","DOIUrl":null,"url":null,"abstract":"\nPurpose\nRF transceiver module is considered a vital part of any wireless communication system. This module consists of two important parts the RF transceiver and analog-to-digital converter (ADC). Usually, both these parts – RF transceiver and ADC – are used to enhance the perspective of size and power. The data processing in 4G communication makes hurdles and need research attention to make it faster and smaller in size. Accuracy and fast processing are the critical challenges in the modern communication system.\n\n\nDesign/methodology/approach\nAfter theoretical and practical investigations, this research work proposes key new techniques for the RF transceiver module. These techniques will make RF transceiver small, power-efficient and on the other hand, make dual SAR-ADC more effective as well. The proposed design has no intermediate frequency where the RF transceiver is reduced its major blocks from five to four, which includes crystal oscillator, phase lock loop, power amplifier and low noise amplifier. Moreover, the shared circuitry is introduced in the architecture of the SAR-ADC for the production of dual outputs, specifically in bootstrapped switch and comparator.\n\n\nFindings\nThe miniaturized RF transceiver and SAR-ADC are well tested separately before the plantation on the printed circuit board (PCB). The operating voltage and frequency of the RF transceiver module are 1.2 V and 5.8 GHz, where the sampling rate, bandwidth and output power are 25 MHz, 200 MHz and 5 dBm, respectively. The core area of the PCB is 58.13 mm2. The bandwidth efficiency is 93% using surface acoustic wave less transmitter. The circuit is based on the library of 90 nm CMOS technology.\n\n\nOriginality/value\nThe entire circuit is highly synchronized with the input and reference clocks to avoid self-interference.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2022-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications\",\"authors\":\"M. Faheem, Muhammad Basit Azeem, A. A. Minhas, Shun'an Zhong, Xinghua Wang\",\"doi\":\"10.1108/mi-06-2021-0054\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nRF transceiver module is considered a vital part of any wireless communication system. This module consists of two important parts the RF transceiver and analog-to-digital converter (ADC). Usually, both these parts – RF transceiver and ADC – are used to enhance the perspective of size and power. The data processing in 4G communication makes hurdles and need research attention to make it faster and smaller in size. Accuracy and fast processing are the critical challenges in the modern communication system.\\n\\n\\nDesign/methodology/approach\\nAfter theoretical and practical investigations, this research work proposes key new techniques for the RF transceiver module. These techniques will make RF transceiver small, power-efficient and on the other hand, make dual SAR-ADC more effective as well. The proposed design has no intermediate frequency where the RF transceiver is reduced its major blocks from five to four, which includes crystal oscillator, phase lock loop, power amplifier and low noise amplifier. 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Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications
Purpose
RF transceiver module is considered a vital part of any wireless communication system. This module consists of two important parts the RF transceiver and analog-to-digital converter (ADC). Usually, both these parts – RF transceiver and ADC – are used to enhance the perspective of size and power. The data processing in 4G communication makes hurdles and need research attention to make it faster and smaller in size. Accuracy and fast processing are the critical challenges in the modern communication system.
Design/methodology/approach
After theoretical and practical investigations, this research work proposes key new techniques for the RF transceiver module. These techniques will make RF transceiver small, power-efficient and on the other hand, make dual SAR-ADC more effective as well. The proposed design has no intermediate frequency where the RF transceiver is reduced its major blocks from five to four, which includes crystal oscillator, phase lock loop, power amplifier and low noise amplifier. Moreover, the shared circuitry is introduced in the architecture of the SAR-ADC for the production of dual outputs, specifically in bootstrapped switch and comparator.
Findings
The miniaturized RF transceiver and SAR-ADC are well tested separately before the plantation on the printed circuit board (PCB). The operating voltage and frequency of the RF transceiver module are 1.2 V and 5.8 GHz, where the sampling rate, bandwidth and output power are 25 MHz, 200 MHz and 5 dBm, respectively. The core area of the PCB is 58.13 mm2. The bandwidth efficiency is 93% using surface acoustic wave less transmitter. The circuit is based on the library of 90 nm CMOS technology.
Originality/value
The entire circuit is highly synchronized with the input and reference clocks to avoid self-interference.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.