Assembly and interconnection technology for high-temperature bulk acoustic wave resonators

Abstract. A sensor based on a piezoelectric single crystal enables operation even under harsh environmental conditions. In addition to the sensor element, the packaging technology is crucial for sensor performance. In this paper, a suitable assembly and interconnection technology concept of Ca3TaGa3Si2O14 (CTGS) resonators for high-temperature applications is presented as a platform for future sensor assemblies. The concept described here has already been functionally tested as a temperature sensor (Schulz et al., 2021). The concept includes a sapphire base plate, a housing lid, and a spacer made from aluminium oxide (Al2O3). The substrate is metallised with platinum manufactured into thin film and thick film technology. The ceramic components are fused with glass solder. The connection of the resonator to the conductive tracks is realised by thermosonic bonding with 25 µm platinum wire. Initially, the stability of the metallisation must be investigated before subsequent electrical testing under high temperature. Diffusion processes play a major role in this temperature range, and the stability of the layer is a necessary condition for subsequent investigations. A suitable set of bonding parameters and the strength of the platinum bonds prior to and after thermal load is analysed. Shear tests are used to evaluate the quality of the ceramic materials fused with glass solder after thermal ageing. The dielectrical properties of sapphire and glass solder such as the isolation resistance, the relative permittivity, and the loss factor at high temperatures are evaluated using interdigital structures. The loss factor is measured on both bare interdigital structures and the samples coated with glass solder to make an estimation about the conductive behaviour up to 1000 ∘C. A ceramic lid for the sensor housing is attached by a high-temperature stable glass solder. Since platinum conductors are fed through this glass solder connection, the electrical conductivity of the glass solder is characterised at high temperature. Furthermore, the hermeticity of the assemblies is verified by means of helium leakage tests. These investigations are the basis for the implementation of an assembly and interconnection technology that is suitable for reliable operation under extreme temperature conditions. The packaging technology also offers further possibilities for pressure or chemical sensors that can withstand high-temperature loads.