BP/hBN异质结构增强高电子密度黑磷间的近场热辐射

IF 2.7 3区 工程技术 Q2 ENGINEERING, MECHANICAL Nanoscale and Microscale Thermophysical Engineering Pub Date : 2022-11-28 DOI:10.1080/15567265.2022.2151717
Hua-Dong Huang, Shi-quan Shan, Zhijun Zhou
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引用次数: 1

摘要

黑磷(BP)/六方氮化硼(hBN)范德华异质结构由于其比单层BP膜更高的稳定性,在基于BP的器件中具有巨大的应用潜力。研究了两种相同的高电子密度BP/hBN异质结构之间的近场热辐射(NFTR),以促进基于BP的器件的应用。与电子密度n大于1×1013cm−2的BP膜相比,由于表面等离子体激元(SPP)和双曲声子激元(HPP)的耦合,BP/hBN异质结构在10nm的间隙距离处显示出更高的传热系数(HTC)。特别是当n≥3×1013cm−2时,改善率超过100%。SPPs和HPPs在双曲区外耦合成表面等离子体-声子极性子(SPPs),在双曲区内耦合成双曲等离子体-声子极化子(HPPP)。SPPs可以在比SPPs更宽的波矢区域中实现光子隧穿,对热传递做出大部分贡献。还讨论了hBN片的厚度和间隙距离的影响。该方案仅有效地增强了在小纳米间隙具有高电子密度的BP的NFTR。经过结构优化后,对于低电子密度的BP/hBN构型,h=2nm是最佳厚度,例如n=1×1013cm−2。相反,对于具有高电子密度的BP,大厚度h=500nm是最佳的。在高电子密度下,厚hBN片在增强I型区以下频率的SPPP和II型区内的HPPP方面是突出的。我们进一步提出了BP/hBN/BP异质结构,并发现由于更稳健的表面模式,HTC进一步增强了4.4%~30.8%。我们的工作可能有助于开发基于BP的近场热器件,并促进对BP/hBN异质结构的NFTR机制的理解。
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Enhanced near-field thermal radiation between black phosphorus with high electron density by BP/hBN heterostructures
ABSTRACT The black phosphorus (BP)/hexagonal boron nitride (hBN) Van der Waals heterostructure has great potential application in BP-based devices due to its higher stability than monolayer BP film. The near-field thermal radiation (NFTR) between two identical BP/hBN heterostructures with high electron density is studied to promote the application of BP-based devices. The BP/hBN heterostructures show a higher heat transfer coefficient (HTC) at a 10 nm gap distance compared to BP films with electron density n larger than 1 × 1013 cm−2, due to the coupling of surface plasmon polaritons (SPPs) and hyperbolic phonon polaritons (HPPs). Especially at n ≥ 3 × 1013 cm−2, the improvement is more than 100%. The SPPs and the HPPs couple into surface plasmon-phonon polaritons (SPPPs) out of the hyperbolic region and hyperbolic plasmon-phonon polaritons (HPPPs) inside. The SPPPs can achieve photon tunneling in the broader wavevector region than SPPs, making most of the contribution to heat transfer. The influences of the thickness of the hBN sheet and gap distance are also discussed. This scheme only effectively enhances NFTR for BP with high electron density at small nanogaps. After structural optimization, h = 2 nm is the optimal thickness for BP/hBN configuration with low electron density, such as n = 1 × 1013 cm−2. In contrast, large thickness h = 500 nm is optimal for BP with high electron density. At high electron density, a thick hBN sheet is prominent in enhancing the SPPPs in the frequencies below the type-I region and the HPPPs inside the type-II region. We further propose BP/hBN/BP heterostructures and find that HTC is further enhanced by 4.4% ~ 30.8% due to the more robust surface modes. Our work may contribute to developing BP-based near-field thermal devices and promote understanding the NFTR mechanism of BP/hBN heterostructure.
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来源期刊
Nanoscale and Microscale Thermophysical Engineering
Nanoscale and Microscale Thermophysical Engineering 工程技术-材料科学:表征与测试
CiteScore
5.90
自引率
2.40%
发文量
12
审稿时长
3.3 months
期刊介绍: Nanoscale and Microscale Thermophysical Engineering is a journal covering the basic science and engineering of nanoscale and microscale energy and mass transport, conversion, and storage processes. In addition, the journal addresses the uses of these principles for device and system applications in the fields of energy, environment, information, medicine, and transportation. The journal publishes both original research articles and reviews of historical accounts, latest progresses, and future directions in this rapidly advancing field. Papers deal with such topics as: transport and interactions of electrons, phonons, photons, and spins in solids, interfacial energy transport and phase change processes, microscale and nanoscale fluid and mass transport and chemical reaction, molecular-level energy transport, storage, conversion, reaction, and phase transition, near field thermal radiation and plasmonic effects, ultrafast and high spatial resolution measurements, multi length and time scale modeling and computations, processing of nanostructured materials, including composites, micro and nanoscale manufacturing, energy conversion and storage devices and systems, thermal management devices and systems, microfluidic and nanofluidic devices and systems, molecular analysis devices and systems.
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