表面激活键合制备极性反转LiNbO3/GaN通道波导,用于高效横向准相位匹配波长转换

IF 1.5 4区 物理与天体物理 Q3 PHYSICS, APPLIED Japanese Journal of Applied Physics Pub Date : 2023-09-08 DOI:10.35848/1347-4065/acf823
Ryosuke Noro, Mariko Adachi, Yasufumi Fujiwara, M. Uemukai, T. Tanikawa, R. Katayama
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引用次数: 0

摘要

GaN是一种用于集成光量子器件的有吸引力的材料。在GaN中添加掺杂MgO的全等LiNbO3(MgO:CLN)的大的光学非线性将提高量子光源的效率。在这项工作中,我们提出了波导核心材料为MgO:CLN和GaN的横向准相位匹配波长转换器件。波导芯通过无粘附表面活性结合(SAB)形成。通过优化接合条件并使用化学机械抛光将GaN膜的表面粗糙度在100×100μm2区域内降低到0.5nm,获得了高薄膜转移产率和4MPa的高接合强度。采用MgO:CLN薄膜转移、剥离和干法刻蚀工艺成功制备了MgO:CLN/GaN波导结构。这种MgO:CLN/GaN无粘附SAB技术有望应用于各种器件,如光学器件和电子器件,以增强其功能。
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Fabrication of polarity inverted LiNbO3/GaN channel waveguide by surface activated bonding for high-efficiency transverse quasi-phase-matched wavelength conversion
GaN is an attractive material for integrating optical quantum devices. Adding a large optical nonlinearity of MgO doped congruent LiNbO3 (MgO:CLN) to GaN will improve the efficiency of quantum light sources. In this work, we proposed transverse quasi-phase-matched wavelength conversion devices with waveguide core materials of MgO:CLN and GaN. The waveguide core is formed by an adhesion-free surface activated bonding (SAB). A high thin film transfer yield was achieved with a high bonding strength of 4 MPa by optimizing the bonding conditions and reducing the surface roughness of the GaN film to be 0.5 nm in a 100 × 100 μm2 area using chemical mechanical polishing. The MgO:CLN/GaN waveguide structure was successfully fabricated by MgO:CLN thin film transfer, lift-off and dry etching processes. This MgO:CLN/GaN adhesion-free SAB technique is expected to be applied to various devices, such as optical devices and electronic devices, to enhance their functionality.
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来源期刊
Japanese Journal of Applied Physics
Japanese Journal of Applied Physics 物理-物理:应用
CiteScore
3.00
自引率
26.70%
发文量
818
审稿时长
3.5 months
期刊介绍: The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS
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