{"title":"电迁移引起的界面扩散引起的互连中夹杂物不稳定性和分裂过程的相场模拟","authors":"Linyong Zhou, Peizhen Huang, Jiaming Zhang","doi":"10.2140/jomms.2023.18.39","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":50134,"journal":{"name":"Journal of Mechanics of Materials and Structures","volume":null,"pages":null},"PeriodicalIF":0.9000,"publicationDate":"2023-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Phase field simulation of the inclusion instability and splitting processes in interconnects due to interface diffusion induced by electromigration\",\"authors\":\"Linyong Zhou, Peizhen Huang, Jiaming Zhang\",\"doi\":\"10.2140/jomms.2023.18.39\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":50134,\"journal\":{\"name\":\"Journal of Mechanics of Materials and Structures\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.9000,\"publicationDate\":\"2023-03-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Mechanics of Materials and Structures\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.2140/jomms.2023.18.39\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Mechanics of Materials and Structures","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.2140/jomms.2023.18.39","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
期刊介绍:
Drawing from all areas of engineering, materials, and biology, the mechanics of solids, materials, and structures is experiencing considerable growth in directions not anticipated a few years ago, which involve the development of new technology requiring multidisciplinary simulation. The journal stimulates this growth by emphasizing fundamental advances that are relevant in dealing with problems of all length scales. Of growing interest are the multiscale problems with an interaction between small and large scale phenomena.