用于节能计算的自旋电子器件专题

IF 2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Journal on Exploratory Solid-State Computational Devices and Circuits Pub Date : 2022-12-01 DOI:10.1109/JXCDC.2023.3264859

Jian-Ping Wang

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引用次数: 0

摘要

在摩尔定律的指导下，半导体器件的传统尺寸趋势已经接近极限，制造中的节点尺寸已经降至2nm。异构集成最近已经成为推动半导体技术进一步发展的主要驱动力之一，在工程上付出了巨大的努力，以总结已知和已建立的技术的力量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Special Topic on Spintronic Devices for Energy-Efficient Computing

The traditional scaling trend of semiconductor devices is approaching its limit with the node size in manufacturing already down to 2 nm, with a great guidance from Moore’s law. Heterogenous integration has recently been one of the major driving forces to push the semiconductor technologies further, with a great engineering effort to sum up the power of known and established technologies.

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