解释芯片制造向东亚的地理转移和半导体全球生产网络的市场动态

IF 7.2 1区 经济学 Q1 ECONOMICS Economic Geography Pub Date : 2022-03-18 DOI:10.1080/00130095.2021.2019010
H. Yeung
{"title":"解释芯片制造向东亚的地理转移和半导体全球生产网络的市场动态","authors":"H. Yeung","doi":"10.1080/00130095.2021.2019010","DOIUrl":null,"url":null,"abstract":"Abstract Few recent geographic studies have focused on how market dynamics might explain macroregional shifts in industrial production. This article examines the pivoting of semiconductor manufacturing toward East Asia during the 2010s, drawing upon proprietary data sets and interviews with leading semiconductor firms. Building on the existing conceptions of user-producer collaborations in economic geography, I conceptualize the relevance of market dynamics for explaining industrial-geographic change. In particular, I specify how customer intimacy in intermediate markets and demand responsiveness in end markets, as two critical dimensions of market dynamics, create strong demand for new chip-making capacity, and how spatial and relational proximity can strengthen interfirm collaboration and customer intimacy in semiconductor production networks. Empirically, market dynamics prompting massive growth in East Asian chip-making capacity are manifested in new product transition and chip demand from global lead firms in the information and communications technology sector and their manufacturing partners mostly located in East Asia. Demand responsiveness to new lead firms and end markets within East Asia has also induced chip design and new capacity to be colocated in the region. Customer intimacy between chip design firms and their foundry providers has led to massive growth of outsourced wafer fabrication in East Asia. Complementing supply-side explanations, such as state support and technological leveraging, this article’s core findings on demand-led market dynamics in explaining geographic shifts in semiconductor manufacturing contribute not only to the studies of global production networks in high-tech industries but also to the renewed interest among geographers in market dynamics and their consequences for uneven development.","PeriodicalId":48225,"journal":{"name":"Economic Geography","volume":"98 1","pages":"272 - 298"},"PeriodicalIF":7.2000,"publicationDate":"2022-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Explaining Geographic Shifts of Chip Making toward East Asia and Market Dynamics in Semiconductor Global Production Networks\",\"authors\":\"H. Yeung\",\"doi\":\"10.1080/00130095.2021.2019010\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Few recent geographic studies have focused on how market dynamics might explain macroregional shifts in industrial production. This article examines the pivoting of semiconductor manufacturing toward East Asia during the 2010s, drawing upon proprietary data sets and interviews with leading semiconductor firms. Building on the existing conceptions of user-producer collaborations in economic geography, I conceptualize the relevance of market dynamics for explaining industrial-geographic change. In particular, I specify how customer intimacy in intermediate markets and demand responsiveness in end markets, as two critical dimensions of market dynamics, create strong demand for new chip-making capacity, and how spatial and relational proximity can strengthen interfirm collaboration and customer intimacy in semiconductor production networks. Empirically, market dynamics prompting massive growth in East Asian chip-making capacity are manifested in new product transition and chip demand from global lead firms in the information and communications technology sector and their manufacturing partners mostly located in East Asia. Demand responsiveness to new lead firms and end markets within East Asia has also induced chip design and new capacity to be colocated in the region. Customer intimacy between chip design firms and their foundry providers has led to massive growth of outsourced wafer fabrication in East Asia. Complementing supply-side explanations, such as state support and technological leveraging, this article’s core findings on demand-led market dynamics in explaining geographic shifts in semiconductor manufacturing contribute not only to the studies of global production networks in high-tech industries but also to the renewed interest among geographers in market dynamics and their consequences for uneven development.\",\"PeriodicalId\":48225,\"journal\":{\"name\":\"Economic Geography\",\"volume\":\"98 1\",\"pages\":\"272 - 298\"},\"PeriodicalIF\":7.2000,\"publicationDate\":\"2022-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Economic Geography\",\"FirstCategoryId\":\"96\",\"ListUrlMain\":\"https://doi.org/10.1080/00130095.2021.2019010\",\"RegionNum\":1,\"RegionCategory\":\"经济学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ECONOMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Economic Geography","FirstCategoryId":"96","ListUrlMain":"https://doi.org/10.1080/00130095.2021.2019010","RegionNum":1,"RegionCategory":"经济学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ECONOMICS","Score":null,"Total":0}
引用次数: 10

摘要

摘要最近很少有地理研究关注市场动态如何解释工业生产的宏观区域变化。本文利用专有数据集和对领先半导体公司的采访,探讨了2010年代半导体制造业向东亚的转变。在经济地理学中现有的用户-生产者合作概念的基础上,我对市场动力学解释工业地理变化的相关性进行了概念化。特别是,我详细说明了中间市场的客户亲密度和终端市场的需求响应能力,作为市场动态的两个关键维度,如何创造对新芯片制造能力的强劲需求,以及空间和关系的接近度如何加强半导体生产网络中的企业间协作和客户亲密度。从经验上看,促使东亚芯片制造能力大幅增长的市场动态表现在信息和通信技术领域的全球领先公司及其主要位于东亚的制造合作伙伴的新产品转型和芯片需求上。对东亚新的领先公司和终端市场的需求响应也促使芯片设计和新产能在该地区集中部署。芯片设计公司与其代工供应商之间的客户亲密关系导致了东亚外包晶圆制造的巨大增长。补充供给侧的解释,如国家支持和技术杠杆,本文在解释半导体制造业的地理变化时,对需求导向的市场动态的核心发现不仅有助于研究高科技行业的全球生产网络,也有助于地理学家对市场动态及其对不均衡发展的影响重新产生兴趣。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Explaining Geographic Shifts of Chip Making toward East Asia and Market Dynamics in Semiconductor Global Production Networks
Abstract Few recent geographic studies have focused on how market dynamics might explain macroregional shifts in industrial production. This article examines the pivoting of semiconductor manufacturing toward East Asia during the 2010s, drawing upon proprietary data sets and interviews with leading semiconductor firms. Building on the existing conceptions of user-producer collaborations in economic geography, I conceptualize the relevance of market dynamics for explaining industrial-geographic change. In particular, I specify how customer intimacy in intermediate markets and demand responsiveness in end markets, as two critical dimensions of market dynamics, create strong demand for new chip-making capacity, and how spatial and relational proximity can strengthen interfirm collaboration and customer intimacy in semiconductor production networks. Empirically, market dynamics prompting massive growth in East Asian chip-making capacity are manifested in new product transition and chip demand from global lead firms in the information and communications technology sector and their manufacturing partners mostly located in East Asia. Demand responsiveness to new lead firms and end markets within East Asia has also induced chip design and new capacity to be colocated in the region. Customer intimacy between chip design firms and their foundry providers has led to massive growth of outsourced wafer fabrication in East Asia. Complementing supply-side explanations, such as state support and technological leveraging, this article’s core findings on demand-led market dynamics in explaining geographic shifts in semiconductor manufacturing contribute not only to the studies of global production networks in high-tech industries but also to the renewed interest among geographers in market dynamics and their consequences for uneven development.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Economic Geography
Economic Geography Multiple-
CiteScore
9.70
自引率
2.90%
发文量
0
期刊介绍: Economic Geography is a peer-reviewed journal dedicated to publishing original research that advances the field of economic geography. Their goal is to publish high-quality studies that are both theoretically robust and grounded in empirical evidence, contributing to our understanding of the geographic factors and consequences of economic processes. It welcome submissions on a wide range of topics that provide primary evidence for significant theoretical interventions, offering key insights into important economic, social, development, and environmental issues. To ensure the highest quality publications, all submissions undergo a rigorous peer-review process with at least three external referees and an editor. Economic Geography has been owned by Clark University since 1925 and plays a central role in supporting the global activities of the field, providing publications and other forms of scholarly support. The journal is published five times a year in January, March, June, August, and November.
期刊最新文献
From Paso del Norte to the Borderplex: Labor Devaluation, Bordering, and the Remaking of Uneven Development in the US–Mexico Borderlands Geographies of Knowledge Sourcing and the Complexity of Knowledge in Multilocational Firms State–Firm Nexus, Indigenous Coupling, and Social Downgrading in the Aerospace Global Production Network: A Case Study of Embraer, Brazil Agency, Temporalities, and the Mediation of COVID within Global Production Networks Theory and Explanation in Geography
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1