弯曲微结构单晶SiC超精密金刚石车削刀具-工件相互作用机理

IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING International Journal of Machine Tools & Manufacture Pub Date : 2023-10-01 DOI:10.1016/j.ijmachtools.2023.104063
Weihai Huang, Jiwang Yan
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引用次数: 2

摘要

单晶碳化硅(SiC)是电子和光学领域最具吸引力的材料之一,但由于其硬脆的特性,极难切割。在之前的研究中,重点放在加工平面上,而在本研究中,通过超精密金刚石车削微凹窝,探索了刀具-工件相互作用在4H-SiC(0001)上切割弯曲组织的机制。对被加工工件和所用金刚石刀具的表面/亚表面进行了表征,并对切屑形成和切削力等加工特性进行了研究。结果表明,在韧窝的进/切入区容易产生微裂纹,这是由较大的推力引起的摩擦拉应力引起的。韧窝位于次级解理方向<10−10>(s -韧窝)易于产生无裂纹表面,而位于初级解理方向的韧窝<−12−10>(p -韧窝)很容易在表面造成裂纹,即使切屑是在延性模式下形成的。位于中间方向的韧窝(i型韧窝)较易发生表面开裂。s -韧窝表面无裂纹,但有最厚的亚表面损伤层(SSD),其中包含无序层、位错和层错;P-和i -韧窝的SSD层不存在堆叠故障;i窝的SSD层是最薄的。在没有检测到边缘切屑和金刚石石墨化的情况下,金刚石刀具表面纳米级凹槽的磨损非常明显。通过优化切削条件,制备了具有纳米表面粗糙度的无裂纹微韧窝阵列。本研究的发现为高表面完整性的弯曲SiC部件的制造提供了指导,例如用于复制微透镜阵列和玻璃上其他自由曲面的模具。
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Mechanisms of tool-workpiece interaction in ultraprecision diamond turning of single-crystal SiC for curved microstructures

Single-crystal silicon carbide (SiC) is one of the most attractive materials for electronics and optics but extremely difficult to cut owing to its hard and brittle properties. While in previous studies, the focus has been placed on machining flat surfaces, in this study, the mechanisms of tool-workpiece interaction in cutting curved microstructures on 4H–SiC (0001) were explored through the ultraprecision diamond turning of micro-dimples. The surface/subsurface of both machined workpieces and used diamond tools were characterized, and the machining characteristics, such as chip formation and cutting forces, were also investigated. It was found that microcracks occurred easily in the feed-in/cut-in area of the dimples, which is caused by a large friction-induced tensile stress due to a large thrust force. The dimples located on the secondary cleavage directions <10−10> (S-dimples) were easy to produce crack-free surfaces, while the dimples located on the primary cleavage directions <−12−10> (P-dimples) were very prone to cause cracks on surfaces, even though the chips were formed in a ductile mode. The dimples located on the in-between direction (I-dimples) were moderately prone to surface cracking. It was also found that although the S-dimple has a crack-free surface, it has the thickest subsurface damage (SSD) layer containing a disordered layer, dislocations, and stacking faults; the SSD layer of the P- and I-dimples do not contain stacking faults; and the SSD layer of the I-dimple is the thinnest. Flank wear with nanoscale grooves on the diamond tool was significant without edge chipping and diamond graphitization detected. By optimizing the cutting conditions, a crack-free micro-dimple array was fabricated with nanometric surface roughness. The findings from this study provide guidance for the manufacture of curved SiC parts with high surface integrity, such as molds for replicating microlens arrays and other freeform surfaces on glass.

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来源期刊
CiteScore
25.70
自引率
10.00%
发文量
66
审稿时长
18 days
期刊介绍: The International Journal of Machine Tools and Manufacture is dedicated to advancing scientific comprehension of the fundamental mechanics involved in processes and machines utilized in the manufacturing of engineering components. While the primary focus is on metals, the journal also explores applications in composites, ceramics, and other structural or functional materials. The coverage includes a diverse range of topics: - Essential mechanics of processes involving material removal, accretion, and deformation, encompassing solid, semi-solid, or particulate forms. - Significant scientific advancements in existing or new processes and machines. - In-depth characterization of workpiece materials (structure/surfaces) through advanced techniques (e.g., SEM, EDS, TEM, EBSD, AES, Raman spectroscopy) to unveil new phenomenological aspects governing manufacturing processes. - Tool design, utilization, and comprehensive studies of failure mechanisms. - Innovative concepts of machine tools, fixtures, and tool holders supported by modeling and demonstrations relevant to manufacturing processes within the journal's scope. - Novel scientific contributions exploring interactions between the machine tool, control system, software design, and processes. - Studies elucidating specific mechanisms governing niche processes (e.g., ultra-high precision, nano/atomic level manufacturing with either mechanical or non-mechanical "tools"). - Innovative approaches, underpinned by thorough scientific analysis, addressing emerging or breakthrough processes (e.g., bio-inspired manufacturing) and/or applications (e.g., ultra-high precision optics).
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