{"title":"弯曲微结构单晶SiC超精密金刚石车削刀具-工件相互作用机理","authors":"Weihai Huang, Jiwang Yan","doi":"10.1016/j.ijmachtools.2023.104063","DOIUrl":null,"url":null,"abstract":"<div><p><span>Single-crystal silicon carbide (SiC) is one of the most attractive materials for electronics and optics but extremely difficult to cut owing to its hard and brittle properties. While in previous studies, the focus has been placed on machining flat surfaces, in this study, the mechanisms of tool-workpiece interaction in cutting curved microstructures on 4H–SiC (0001) were explored through the ultraprecision diamond turning of micro-dimples. The surface/subsurface of both machined workpieces and used diamond tools were characterized, and the machining characteristics, such as chip formation and cutting forces, were also investigated. It was found that microcracks occurred easily in the feed-in/cut-in area of the dimples, which is caused by a large friction-induced tensile stress due to a large thrust force. The dimples located on the secondary cleavage directions <10−10> (S-dimples) were easy to produce crack-free surfaces, while the dimples located on the primary cleavage directions <−12−10> (P-dimples) were very prone to cause cracks on surfaces, even though the chips were formed in a </span>ductile mode<span>. The dimples located on the in-between direction (I-dimples) were moderately prone to surface cracking. It was also found that although the S-dimple has a crack-free surface, it has the thickest subsurface damage (SSD) layer containing a disordered layer, dislocations, and stacking faults; the SSD layer of the P- and I-dimples do not contain stacking faults; and the SSD layer of the I-dimple is the thinnest. Flank wear<span><span> with nanoscale<span><span> grooves on the diamond tool was significant without edge chipping and diamond graphitization detected. By optimizing the cutting conditions, a crack-free micro-dimple array was fabricated with nanometric surface roughness. The findings from this study provide guidance for the manufacture of curved </span>SiC parts with high surface integrity, such as molds for replicating </span></span>microlens arrays<span> and other freeform surfaces on glass.</span></span></span></p></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"191 ","pages":"Article 104063"},"PeriodicalIF":14.0000,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Mechanisms of tool-workpiece interaction in ultraprecision diamond turning of single-crystal SiC for curved microstructures\",\"authors\":\"Weihai Huang, Jiwang Yan\",\"doi\":\"10.1016/j.ijmachtools.2023.104063\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p><span>Single-crystal silicon carbide (SiC) is one of the most attractive materials for electronics and optics but extremely difficult to cut owing to its hard and brittle properties. While in previous studies, the focus has been placed on machining flat surfaces, in this study, the mechanisms of tool-workpiece interaction in cutting curved microstructures on 4H–SiC (0001) were explored through the ultraprecision diamond turning of micro-dimples. The surface/subsurface of both machined workpieces and used diamond tools were characterized, and the machining characteristics, such as chip formation and cutting forces, were also investigated. It was found that microcracks occurred easily in the feed-in/cut-in area of the dimples, which is caused by a large friction-induced tensile stress due to a large thrust force. The dimples located on the secondary cleavage directions <10−10> (S-dimples) were easy to produce crack-free surfaces, while the dimples located on the primary cleavage directions <−12−10> (P-dimples) were very prone to cause cracks on surfaces, even though the chips were formed in a </span>ductile mode<span>. The dimples located on the in-between direction (I-dimples) were moderately prone to surface cracking. It was also found that although the S-dimple has a crack-free surface, it has the thickest subsurface damage (SSD) layer containing a disordered layer, dislocations, and stacking faults; the SSD layer of the P- and I-dimples do not contain stacking faults; and the SSD layer of the I-dimple is the thinnest. Flank wear<span><span> with nanoscale<span><span> grooves on the diamond tool was significant without edge chipping and diamond graphitization detected. By optimizing the cutting conditions, a crack-free micro-dimple array was fabricated with nanometric surface roughness. The findings from this study provide guidance for the manufacture of curved </span>SiC parts with high surface integrity, such as molds for replicating </span></span>microlens arrays<span> and other freeform surfaces on glass.</span></span></span></p></div>\",\"PeriodicalId\":14011,\"journal\":{\"name\":\"International Journal of Machine Tools & Manufacture\",\"volume\":\"191 \",\"pages\":\"Article 104063\"},\"PeriodicalIF\":14.0000,\"publicationDate\":\"2023-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Machine Tools & Manufacture\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0890695523000718\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Machine Tools & Manufacture","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0890695523000718","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Mechanisms of tool-workpiece interaction in ultraprecision diamond turning of single-crystal SiC for curved microstructures
Single-crystal silicon carbide (SiC) is one of the most attractive materials for electronics and optics but extremely difficult to cut owing to its hard and brittle properties. While in previous studies, the focus has been placed on machining flat surfaces, in this study, the mechanisms of tool-workpiece interaction in cutting curved microstructures on 4H–SiC (0001) were explored through the ultraprecision diamond turning of micro-dimples. The surface/subsurface of both machined workpieces and used diamond tools were characterized, and the machining characteristics, such as chip formation and cutting forces, were also investigated. It was found that microcracks occurred easily in the feed-in/cut-in area of the dimples, which is caused by a large friction-induced tensile stress due to a large thrust force. The dimples located on the secondary cleavage directions <10−10> (S-dimples) were easy to produce crack-free surfaces, while the dimples located on the primary cleavage directions <−12−10> (P-dimples) were very prone to cause cracks on surfaces, even though the chips were formed in a ductile mode. The dimples located on the in-between direction (I-dimples) were moderately prone to surface cracking. It was also found that although the S-dimple has a crack-free surface, it has the thickest subsurface damage (SSD) layer containing a disordered layer, dislocations, and stacking faults; the SSD layer of the P- and I-dimples do not contain stacking faults; and the SSD layer of the I-dimple is the thinnest. Flank wear with nanoscale grooves on the diamond tool was significant without edge chipping and diamond graphitization detected. By optimizing the cutting conditions, a crack-free micro-dimple array was fabricated with nanometric surface roughness. The findings from this study provide guidance for the manufacture of curved SiC parts with high surface integrity, such as molds for replicating microlens arrays and other freeform surfaces on glass.
期刊介绍:
The International Journal of Machine Tools and Manufacture is dedicated to advancing scientific comprehension of the fundamental mechanics involved in processes and machines utilized in the manufacturing of engineering components. While the primary focus is on metals, the journal also explores applications in composites, ceramics, and other structural or functional materials. The coverage includes a diverse range of topics:
- Essential mechanics of processes involving material removal, accretion, and deformation, encompassing solid, semi-solid, or particulate forms.
- Significant scientific advancements in existing or new processes and machines.
- In-depth characterization of workpiece materials (structure/surfaces) through advanced techniques (e.g., SEM, EDS, TEM, EBSD, AES, Raman spectroscopy) to unveil new phenomenological aspects governing manufacturing processes.
- Tool design, utilization, and comprehensive studies of failure mechanisms.
- Innovative concepts of machine tools, fixtures, and tool holders supported by modeling and demonstrations relevant to manufacturing processes within the journal's scope.
- Novel scientific contributions exploring interactions between the machine tool, control system, software design, and processes.
- Studies elucidating specific mechanisms governing niche processes (e.g., ultra-high precision, nano/atomic level manufacturing with either mechanical or non-mechanical "tools").
- Innovative approaches, underpinned by thorough scientific analysis, addressing emerging or breakthrough processes (e.g., bio-inspired manufacturing) and/or applications (e.g., ultra-high precision optics).