利用40nm CMOS工艺实现的1.0fJ能量/位单端1kb 6T SRAM

IF 1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Iet Circuits Devices & Systems Pub Date : 2023-01-10 DOI:10.1049/cds2.12141
Chua-Chin Wang, Ralph Gerard B. Sangalang, I-Ting Tseng, Yi-Jen Chiu, Yu-Cheng Lin, Oliver Lexter July A. Jose
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引用次数: 3

摘要

本研究在硅上展示了一种由单端单元组成的超低能量SRAM。更具体地,单元的供电电压由字线(WL)使能选通,并且电压模式选择(VMS)信号选择相应的供电电压中的一个。当单元未被访问时,选择较低的电压以保持存储的位状态,从而降低待机功率。并且当选择单元(即WL被启用)以执行读取或写入(R/W)操作时,使用正常的电源电压。使用40nm CMOS技术在硅上实现了基于具有内置自检(BIST)和功率延迟产生(PDP)减少电路的单端单元的1kb SRAM原型。还公开了所有PVT角变化的理论推导和模拟,以证明低能量性能的合理性。对硅上六个原型的物理测量表明,在10MHz系统时钟下,每比特的能量为1.0fJ。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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A 1.0 fJ energy/bit single-ended 1 kb 6T SRAM implemented using 40 nm CMOS process

An ultra-low-energy SRAM composed of single-ended cells is demonstrated on silicon in this investigation. More specifically, the supply voltages of cells are gated by wordline (WL) enable, and the voltage mode select (VMS) signals select one of the corresponding supply voltages. A lower voltage is selected to maintain stored bit state when cells are not accessed, lowering the standby power. And when selecting a cell (i.e. WL is enabled) to perform the read or write (R/W) operations, the normal supply voltage is used. A 1-kb SRAM prototype based on the single-ended cells with built-in self-test (BIST) and power-delay production (PDP) reduction circuits was realised on silicon using 40-nm CMOS technology. Theoretical derivations and simulations of all-PVT-corner variations are also disclosed to justify low energy performance. Physical measurements of six prototypes on silicon shows that the energy per bit is 1.0 fJ at the 10 MHz system clock.

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来源期刊
Iet Circuits Devices & Systems
Iet Circuits Devices & Systems 工程技术-工程:电子与电气
CiteScore
3.80
自引率
7.70%
发文量
32
审稿时长
3 months
期刊介绍: IET Circuits, Devices & Systems covers the following topics: Circuit theory and design, circuit analysis and simulation, computer aided design Filters (analogue and switched capacitor) Circuit implementations, cells and architectures for integration including VLSI Testability, fault tolerant design, minimisation of circuits and CAD for VLSI Novel or improved electronic devices for both traditional and emerging technologies including nanoelectronics and MEMs Device and process characterisation, device parameter extraction schemes Mathematics of circuits and systems theory Test and measurement techniques involving electronic circuits, circuits for industrial applications, sensors and transducers
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