{"title":"利用置换特征压缩深度神经网络的全连通层","authors":"Dara Nagaraju, Nitin Chandrachoodan","doi":"10.1049/cdt2.12060","DOIUrl":null,"url":null,"abstract":"<p>Modern deep neural networks typically have some fully connected layers at the final classification stages. These stages have large memory requirements that can be expensive on resource-constrained embedded devices and also consume significant energy just to read the parameters from external memory into the processing chip. The authors show that the weights in such layers can be modelled as permutations of a common sequence with minimal impact on recognition accuracy. This allows the storage requirements of FC layer(s) to be significantly reduced, which reflects in the reduction of total network parameters from 1.3× to 36× with a median of 4.45× on several benchmark networks. The authors compare the results with existing pruning, bitwidth reduction, and deep compression techniques and show the superior compression that can be achieved with this method. The authors also showed 7× reduction of parameters on VGG16 architecture with ImageNet dataset. The authors also showed that the proposed method can be used in the classification stage of the transfer learning networks.</p>","PeriodicalId":50383,"journal":{"name":"IET Computers and Digital Techniques","volume":"17 3-4","pages":"149-161"},"PeriodicalIF":1.1000,"publicationDate":"2023-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/cdt2.12060","citationCount":"0","resultStr":"{\"title\":\"Compressing fully connected layers of deep neural networks using permuted features\",\"authors\":\"Dara Nagaraju, Nitin Chandrachoodan\",\"doi\":\"10.1049/cdt2.12060\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Modern deep neural networks typically have some fully connected layers at the final classification stages. These stages have large memory requirements that can be expensive on resource-constrained embedded devices and also consume significant energy just to read the parameters from external memory into the processing chip. The authors show that the weights in such layers can be modelled as permutations of a common sequence with minimal impact on recognition accuracy. This allows the storage requirements of FC layer(s) to be significantly reduced, which reflects in the reduction of total network parameters from 1.3× to 36× with a median of 4.45× on several benchmark networks. The authors compare the results with existing pruning, bitwidth reduction, and deep compression techniques and show the superior compression that can be achieved with this method. The authors also showed 7× reduction of parameters on VGG16 architecture with ImageNet dataset. The authors also showed that the proposed method can be used in the classification stage of the transfer learning networks.</p>\",\"PeriodicalId\":50383,\"journal\":{\"name\":\"IET Computers and Digital Techniques\",\"volume\":\"17 3-4\",\"pages\":\"149-161\"},\"PeriodicalIF\":1.1000,\"publicationDate\":\"2023-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1049/cdt2.12060\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IET Computers and Digital Techniques\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1049/cdt2.12060\",\"RegionNum\":4,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Computers and Digital Techniques","FirstCategoryId":"94","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/cdt2.12060","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
Compressing fully connected layers of deep neural networks using permuted features
Modern deep neural networks typically have some fully connected layers at the final classification stages. These stages have large memory requirements that can be expensive on resource-constrained embedded devices and also consume significant energy just to read the parameters from external memory into the processing chip. The authors show that the weights in such layers can be modelled as permutations of a common sequence with minimal impact on recognition accuracy. This allows the storage requirements of FC layer(s) to be significantly reduced, which reflects in the reduction of total network parameters from 1.3× to 36× with a median of 4.45× on several benchmark networks. The authors compare the results with existing pruning, bitwidth reduction, and deep compression techniques and show the superior compression that can be achieved with this method. The authors also showed 7× reduction of parameters on VGG16 architecture with ImageNet dataset. The authors also showed that the proposed method can be used in the classification stage of the transfer learning networks.
期刊介绍:
IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test.
The key subject areas of interest are:
Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation.
Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance.
Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues.
Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware.
Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting.
Case Studies: emerging applications, applications in industrial designs, and design frameworks.