Hanna Ohlin , Thomas Frisk , Ilya Sychugov , Ulrich Vogt
{"title":"金属辅助化学刻蚀N型和P型硅纳米结构的比较","authors":"Hanna Ohlin , Thomas Frisk , Ilya Sychugov , Ulrich Vogt","doi":"10.1016/j.mne.2023.100178","DOIUrl":null,"url":null,"abstract":"<div><p>Metal assisted chemical etching is a promising method for fabricating high aspect ratio micro- and nanostructures in silicon. Previous results have suggested that P-type and N-type silicon etches with different degrees of anisotropy, questioning the use of P-type silicon for nanostructures. In this study, we compare processing X-ray zone plate nanostructures in N and P-type silicon through metal assisted chemical etching with a gold catalyst. Fabricated zone plates were cleaved and studied with a focus on resulting verticality, depth and porosity. Results show that for high aspect ratio nanostructures, both N and P-type silicon prove to be viable alternatives exhibiting different etch rates, but similarities regarding porosity and etch direction.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"19 ","pages":"Article 100178"},"PeriodicalIF":2.8000,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comparing metal assisted chemical etching of N and P-type silicon nanostructures\",\"authors\":\"Hanna Ohlin , Thomas Frisk , Ilya Sychugov , Ulrich Vogt\",\"doi\":\"10.1016/j.mne.2023.100178\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Metal assisted chemical etching is a promising method for fabricating high aspect ratio micro- and nanostructures in silicon. Previous results have suggested that P-type and N-type silicon etches with different degrees of anisotropy, questioning the use of P-type silicon for nanostructures. In this study, we compare processing X-ray zone plate nanostructures in N and P-type silicon through metal assisted chemical etching with a gold catalyst. Fabricated zone plates were cleaved and studied with a focus on resulting verticality, depth and porosity. Results show that for high aspect ratio nanostructures, both N and P-type silicon prove to be viable alternatives exhibiting different etch rates, but similarities regarding porosity and etch direction.</p></div>\",\"PeriodicalId\":37111,\"journal\":{\"name\":\"Micro and Nano Engineering\",\"volume\":\"19 \",\"pages\":\"Article 100178\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2023-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Micro and Nano Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2590007223000084\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micro and Nano Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590007223000084","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Comparing metal assisted chemical etching of N and P-type silicon nanostructures
Metal assisted chemical etching is a promising method for fabricating high aspect ratio micro- and nanostructures in silicon. Previous results have suggested that P-type and N-type silicon etches with different degrees of anisotropy, questioning the use of P-type silicon for nanostructures. In this study, we compare processing X-ray zone plate nanostructures in N and P-type silicon through metal assisted chemical etching with a gold catalyst. Fabricated zone plates were cleaved and studied with a focus on resulting verticality, depth and porosity. Results show that for high aspect ratio nanostructures, both N and P-type silicon prove to be viable alternatives exhibiting different etch rates, but similarities regarding porosity and etch direction.