电子电路用破裂黄铜塔的失效分析

Nirmal Ninan, S.V.S. Narayana Murty, Sushant Manwatkar, P. Ramesh Narayanan
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引用次数: 7

摘要

铜合金广泛应用于电路中,主要是由于其导电性。在电路中,焊料端子用于提供多个电气连接,由于在动态环境下(如卫星运载火箭的情况下,电气系统受到更高的振动和线路电流影响),焊接型转塔端子具有高可靠性,因此首选。由于可加工性高,易切削黄铜在制造这种小尺寸端子时是首选,这些端子将被冷加工/冲压到印刷电路板上。易切削黄铜的成分选择不当会导致端子开裂,从而影响系统的可靠性。介绍了易切削黄铜转塔端子在锻压过程中的开裂问题。采用光学显微镜和扫描电镜研究了不同成分的黄铜转塔末端在冷加工过程中的裂纹扩展趋势。最后,建议在冷锻过程中获得无裂纹端子的组合物。
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Failure analysis of cracked brass turrets used in electronic circuits

Copper alloys are widely used in electrical circuits mainly due to their electrical conductivity. In electrical circuits, solder terminals are used to provide multiple electrical connections and swage type turret terminals are preferred owing to their high reliability under dynamic environments where the electrical systems are subjected to higher vibrations and line currents, as in the case of satellite launch vehicles. Owing to high machinability, free-cutting brass is preferred in the manufacture of such small sized terminals, which will be cold worked/swaged to the printed circuit boards. Improper selection of the composition of free-cutting brass can lead to cracking of the terminals, thereby affecting the reliability of the system. This paper describes cracking of turret terminals made of free cutting brass during swaging operation. The crack propagation tendency during cold working of brass turret terminals made from different compositions is studied through optical and scanning electron microscopy. Finally, composition for obtaining crack free terminals during swaging is suggested for applications involving cold swaging.

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