柔性电子器件用自修复高分子材料的研究进展

IF 2.702 Q1 Materials Science Journal of Polymer Science Part A: Polymer Chemistry Pub Date : 2023-04-18 DOI:10.1002/pol.20230020
Shanshan Zhu, Zhihao Liu, Wenyao Li, Haiwei Zhang, Guoliang Dai, Xing Zhou
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引用次数: 2

摘要

自修复高分子材料自问世以来一直是智能材料领域的研究热点。它们具有自我诊断功能,能够自我修复小裂缝。通过将自修复材料应用于柔性电子器件,可以减少这些器件因弯曲、折叠和刮擦造成的机械损伤。从而提高设备的可靠性和使用寿命。本文简要介绍了自修复聚合物的研究概况,重点介绍了自修复聚合物在柔性电子器件中的应用。此外,本文还展望了自修复高分子材料的未来发展和面临的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Research progress of self-healing polymer materials for flexible electronic devices

Self-healing polymer materials have been a research hotspot in the field of smart materials since their invention. They have self-diagnostic functions and are capable of self-healing small cracks. By applying self-healing materials to flexible electronic devices, the mechanical damage caused by bending, folding and scratching of these devices can be reduced. The reliability and service life of the devices could be improved accordingly. This paper provides a brief overview of self-healing polymers and focuses on their applications in flexible electronic devices. In addition, this paper prospects the future development and challenges of self-healing polymer materials.

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来源期刊
CiteScore
5.20
自引率
0.00%
发文量
0
审稿时长
1.8 months
期刊介绍: Part A: Polymer Chemistry is devoted to studies in fundamental organic polymer chemistry and physical organic chemistry. This includes all related topics (such as organic, bioorganic, bioinorganic and biological chemistry of monomers, polymers, oligomers and model compounds, inorganic and organometallic chemistry for catalysts, mechanistic studies, supramolecular chemistry aspects relevant to polymer...
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Issue Information - Cover Description Cover Image, Volume 61, Issue 20 Issue Information - Cover Description Cover Image, Volume 61, Issue 19 Emerging researchers interview—Ji Liu, Southern University of Science and Technology
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