热导聚酰亚胺复合膜上可控分布Ti3C2Tx空心微球的电磁屏蔽性能

IF 27.4 1区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY Advanced Materials Pub Date : 2023-01-26 DOI:10.1002/adma.202211642
Yali Zhang, Kunpeng Ruan, Kun Zhou, Junwei Gu
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引用次数: 181

摘要

柔性多功能聚合物基电磁干扰(EMI)屏蔽复合膜在5G通信技术、可穿戴电子设备、人工智能等领域具有重要应用。在多孔/多层结构设计的基础上,以聚酰亚胺(PI)为基体,聚甲基丙烯酸甲酯(PMMA)微球为模板,采用牺牲模板法成功制备了具有可控孔径和Ti3C2Tx空心微球分布的柔性(Fe3O4/PI) - Ti3C2Tx - (Fe3O4/PI)复合薄膜。由于多孔/多层结构,当Ti3C2Tx空心微球孔径为10µm, PMMA/Ti3C2Tx质量比为2:1时,(Fe3O4/PI) - Ti3C2Tx - (Fe3O4/PI)复合膜具有最优异的电磁干扰屏蔽性能,电磁干扰屏蔽效能(EMI SE)为85 dB。有限元仿真进一步验证了复合膜对电磁波具有良好的屏蔽效果。此外,复合膜具有良好的导热系数(导热系数为3.49 W (m·K)−1)和力学性能(抗拉强度为65.3 MPa)。该柔性(Fe3O4/PI) - ti3c2tx - (Fe3O4/PI)复合薄膜具有优异的电磁干扰屏蔽性能、导热性和机械性能,在大功率、便携式和可穿戴柔性电子器件的电磁干扰屏蔽保护中具有巨大的应用潜力。
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Controlled Distributed Ti3C2Tx Hollow Microspheres on Thermally Conductive Polyimide Composite Films for Excellent Electromagnetic Interference Shielding

Flexible multifunctional polymer-based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on the design of a porous/multilayered structure and using polyimide (PI) as the matrix and polymethyl methacrylate (PMMA) microspheres as the template, flexible (Fe3O4/PI)–Ti3C2Tx–(Fe3O4/PI) composite films with controllable pore sizes and distribution of Ti3C2Tx hollow microspheres are successfully prepared by sacrificial template method. Owing to the porous/multilayered structure, when the pore size of the Ti3C2Tx hollow microspheres is 10 µm and the mass ratio of PMMA/Ti3C2Tx is 2:1, the (Fe3O4/PI)–Ti3C2Tx–(Fe3O4/PI) composite film has the most excellent EMI shielding performance, with EMI shielding effectiveness (EMI SE) of 85 dB. It is further verified by finite element simulation that the composite film has an excellent shielding effect on electromagnetic waves. In addition, the composite film has good thermal conductivity (thermal conductivity coefficient of 3.49 W (m·K)−1) and mechanical properties (tensile strength of 65.3 MPa). This flexible (Fe3O4/PI)–Ti3C2Tx–(Fe3O4/PI) composite film with excellent EMI shielding performance, thermal conductivity, and mechanical properties has demonstrated great potential for applications in EMI shielding protection for high-power, portable, and wearable flexible electronic devices.

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来源期刊
Advanced Materials
Advanced Materials 工程技术-材料科学:综合
CiteScore
43.00
自引率
4.10%
发文量
2182
审稿时长
2 months
期刊介绍: Advanced Materials, one of the world's most prestigious journals and the foundation of the Advanced portfolio, is the home of choice for best-in-class materials science for more than 30 years. Following this fast-growing and interdisciplinary field, we are considering and publishing the most important discoveries on any and all materials from materials scientists, chemists, physicists, engineers as well as health and life scientists and bringing you the latest results and trends in modern materials-related research every week.
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