Ni-Mo-Fe电解镀层的电镜观察

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1998-01-01 DOI:10.1080/00202967.1998.11871189
M. Ananth, N. V. Parthasaradhy
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引用次数: 1

摘要

通过改变镀工艺参数,在柠檬酸铵液中制备了Ni-Mo-Fe镀层。用扫描电子显微镜观察其表面形貌和SE成像。发现涂层的电催化、腐蚀和光学性能与表面结构有关。结果还用于了解电沉积变量的影响。镀层直径对镀层表面结构有较大的影响。沉积CD的增加导致了这些材料的相偏析。结果表明,随着镀液中钼含量的增加,镀层中出现了多相的非均质性。在接近中性pH水平下电沉积的样品中观察到晶体结构的多核化,这也是由于钼含量的增加。涂层在300℃时形成网状结构。锰的包裹体有助于获得均质矿床。
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Electron Microscope Observations on Electrolytic Ni-Mo-Fe Coatings
SummarySelected Ni-Mo-Fe coatings were electrodeposited from ammoniacal citrate baths by varying the plating parameters. Their surfaces were examined by scanning electron microscopy for topography and SE imaging. Observed electrocatalytic, corrosion and optical properties of the coatings were found to be dependent on surface structure. The results were also used to understand the influence of electrodeposition variables. The plating diameters were found to have strong influence on the surface structure. Increases in deposition CD resulted in phase segregation in these materials. Also it was confirmed that increases in molybdenum content of the plating bath introduced heterogeneity in the plated samples with occurrence of more than one phase. Multinucleation in crystal structure was observed in samples electrodeposited at near neutral pH levels, again due to increased molybdenum content. The coatings reveal network formation at 300°C. Inclusion of Mn was helpful in obtaining homogeneous deposits.
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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