{"title":"Cu(I)在化学法制备Cu2-xS涂层中的作用","authors":"J. Vinkevičius, G. Valiulienė, A. Žielienė","doi":"10.1080/00202967.1999.11871256","DOIUrl":null,"url":null,"abstract":"The interaction of the Cu 2 O adsorbed with Na 2 S n (n = 1-4 ), during formation of the Cu 2-x S coatings has been investigated by cyclic voltammetry. The summarized reaction of this process has been shown to correspond to the equation: Na 2 S + Cu 2 O ad + H 2 O → Cu 2 S ad + (n-1)S 0 + 2NaOH, where S 0 /Cu=(n 1)/2. Such a stoichiometry of reaction ca be explained by the formation of an intermediate the adsorbed polysulphide of Cu(1) and by its subsequent decomposition into Cu 2 S and S 0 . When a thicker coating is being formed, i.e., when the surface being coated is repeatedly immersed into an ammoniate solution of Cu (1) and S 0 fully bounded: S 0 ad + 2Cu + → CuS + Cu 2 + . At the same time due to different solubility products (L=2.5-10 and 6.3-10 for Cu 2 S and CuS respectively), an exchange CuS ad + 2 (1-x)Cy + →Cu 2-x S ad +(1-x)Cu 2+ occurs. After formation of Cu 2+ . parallel processes characteristic for the interaction of Cu(II) with Na 2 S n start to take place, during which S is also formed.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"91-94"},"PeriodicalIF":1.2000,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871256","citationCount":"6","resultStr":"{\"title\":\"The Role of Cu(I) in the Process of Forming Cu2–xS Coatings by a Chemical Route\",\"authors\":\"J. Vinkevičius, G. Valiulienė, A. Žielienė\",\"doi\":\"10.1080/00202967.1999.11871256\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The interaction of the Cu 2 O adsorbed with Na 2 S n (n = 1-4 ), during formation of the Cu 2-x S coatings has been investigated by cyclic voltammetry. The summarized reaction of this process has been shown to correspond to the equation: Na 2 S + Cu 2 O ad + H 2 O → Cu 2 S ad + (n-1)S 0 + 2NaOH, where S 0 /Cu=(n 1)/2. Such a stoichiometry of reaction ca be explained by the formation of an intermediate the adsorbed polysulphide of Cu(1) and by its subsequent decomposition into Cu 2 S and S 0 . When a thicker coating is being formed, i.e., when the surface being coated is repeatedly immersed into an ammoniate solution of Cu (1) and S 0 fully bounded: S 0 ad + 2Cu + → CuS + Cu 2 + . At the same time due to different solubility products (L=2.5-10 and 6.3-10 for Cu 2 S and CuS respectively), an exchange CuS ad + 2 (1-x)Cy + →Cu 2-x S ad +(1-x)Cu 2+ occurs. After formation of Cu 2+ . parallel processes characteristic for the interaction of Cu(II) with Na 2 S n start to take place, during which S is also formed.\",\"PeriodicalId\":23268,\"journal\":{\"name\":\"Transactions of The Institute of Metal Finishing\",\"volume\":\"77 1\",\"pages\":\"91-94\"},\"PeriodicalIF\":1.2000,\"publicationDate\":\"1999-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1080/00202967.1999.11871256\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of The Institute of Metal Finishing\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/00202967.1999.11871256\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ELECTROCHEMISTRY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of The Institute of Metal Finishing","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/00202967.1999.11871256","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ELECTROCHEMISTRY","Score":null,"Total":0}
引用次数: 6
摘要
用循环伏安法研究了Cu 2-x - S涂层形成过程中Cu 2-x - S与Na 2 S - n (n = 1-4)吸附的相互作用。结果表明,该过程的反应规律为:na2s + cu2o + h2o→cu2s + (n-1) s0 + 2NaOH,其中s0 /Cu=(n -1) /2。这种反应的化学计量可以用吸附多硫化物Cu(1)的中间体的形成及其随后分解成cu2s和s0来解释。当形成较厚的涂层时,即将被涂层表面反复浸入Cu(1)和s0完全结合的氨化溶液中:s0 ad + 2Cu +→Cu + cu2 +。同时由于不同的溶解度产物(Cu 2s和Cu的L分别为2.5-10和6.3-10),发生了Cu ad + 2 (1-x)Cy +→Cu 2-x S ad +(1-x)Cu 2+的交换。cu2 +形成后。Cu(II)与Na (2s) n相互作用的平行过程开始发生,S也在此过程中形成。
The Role of Cu(I) in the Process of Forming Cu2–xS Coatings by a Chemical Route
The interaction of the Cu 2 O adsorbed with Na 2 S n (n = 1-4 ), during formation of the Cu 2-x S coatings has been investigated by cyclic voltammetry. The summarized reaction of this process has been shown to correspond to the equation: Na 2 S + Cu 2 O ad + H 2 O → Cu 2 S ad + (n-1)S 0 + 2NaOH, where S 0 /Cu=(n 1)/2. Such a stoichiometry of reaction ca be explained by the formation of an intermediate the adsorbed polysulphide of Cu(1) and by its subsequent decomposition into Cu 2 S and S 0 . When a thicker coating is being formed, i.e., when the surface being coated is repeatedly immersed into an ammoniate solution of Cu (1) and S 0 fully bounded: S 0 ad + 2Cu + → CuS + Cu 2 + . At the same time due to different solubility products (L=2.5-10 and 6.3-10 for Cu 2 S and CuS respectively), an exchange CuS ad + 2 (1-x)Cy + →Cu 2-x S ad +(1-x)Cu 2+ occurs. After formation of Cu 2+ . parallel processes characteristic for the interaction of Cu(II) with Na 2 S n start to take place, during which S is also formed.
期刊介绍:
Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.