The Electrodeposition of Nickel, Solderable and Wear-resistant Nickel-Boron Alloys from Low Concentrated Colloid-Electrolytes

Some aspects of nickel and nickel-boron alloys plating from low concentrated chloride colloid-electrolyte baths have been investigated. The nature of particles being reduced and the reason for the marked increase in rate of the electrodeposition are discussed. X-ray analysis suggests that the reason for the high and stable solderability of nickel-boron alloys is the presence in the structure of (Ni 3 B).O and (Ni 3 B).16O phases. The phase Ni 4 B 3 is assumed to increase the resistance to wear.