络合剂对化学镀镍层形貌和孔隙率的影响

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871278

Ying Jin, Dong-bai Sun, Jingzhi Yu, C. Dong, Dejun Yang

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引用次数: 5

摘要

选择3种络合剂，研究了它们对低碳钢基体上化学镀镍(EN)镀层形貌和孔隙率的影响。采用电化学技术和常用的化学斑点试验，测试了EN涂层的孔隙率随各种络合剂的作用。同时，利用原子力显微镜(AFM)检测了镀层的形貌和表面粗糙度。结果表明，镍配合物越稳定，镀层的粗糙度越低，孔隙率越小。考虑到络合剂对EN沉积过程的影响，讨论了其原因。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effects of complexing agent on the morphology and porosity of electroless nickel deposits

Three kinds of complexing agents were selected to investigate their effects on the morphology and porosity of electroless nickel (EN) deposits on a mild steel substrate. The porosity of the EN coating was tested as a function of the variety of complexing agents with both an electrochemical technique and commonly used chemical spot tests. Meanwhile, the morphology and surface roughness of deposits were examined by atom force microscopy (AFM). It was found that the more stable is the nickel complex, the lower the roughness and the less the porosity of the coating. The reason for this is discussed, considering the complexing agent's effect on the deposition process of EN.

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.