{"title":"实用论文、文章及应用笔记","authors":"K. See","doi":"10.1109/MEMC.2022.9873814","DOIUrl":null,"url":null,"abstract":"RF receivers for airborne applications are critical systems for wireless signal reception and processing. Any unwanted interfering signals received by the receiver have a direct impact on the quality of the intended signals. The first paper, “Improved Complex Receiver System Design Strategies to Overcome EMI/EMC Challenges,” describes the strategies and implementation techniques for a complex receiver system design to meet environmental stress screening (ESS) requirements, especially EMC. The proposed design methodology segregates the various modules and stacks them together tactfully without compromising EMC. By applying these techniques, an actual design with four modules is demonstrated and tested for EMC compliance over an extreme temperature range from -40°C to +71°C.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Practical papers, articles and application notes\",\"authors\":\"K. See\",\"doi\":\"10.1109/MEMC.2022.9873814\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"RF receivers for airborne applications are critical systems for wireless signal reception and processing. Any unwanted interfering signals received by the receiver have a direct impact on the quality of the intended signals. The first paper, “Improved Complex Receiver System Design Strategies to Overcome EMI/EMC Challenges,” describes the strategies and implementation techniques for a complex receiver system design to meet environmental stress screening (ESS) requirements, especially EMC. The proposed design methodology segregates the various modules and stacks them together tactfully without compromising EMC. By applying these techniques, an actual design with four modules is demonstrated and tested for EMC compliance over an extreme temperature range from -40°C to +71°C.\",\"PeriodicalId\":73281,\"journal\":{\"name\":\"IEEE electromagnetic compatibility magazine\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE electromagnetic compatibility magazine\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMC.2022.9873814\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE electromagnetic compatibility magazine","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMC.2022.9873814","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
摘要
这期的特色是三篇有趣而多样的关于电磁效应和电磁兼容性的论文。第一篇论文,“900兆赫时非均匀头部模型中的能量吸收分布”,由以色列Holon理工学院的M. Haridim, B. Levin, S. Revich, S. Chulski和R. Zemach贡献;和法国雷恩大学的R. Sauleau。他们开发了一个由许多组织组成的非均匀人头模型,用于评估头部内900兆赫的电磁场(EM)。通过数值模拟整个头部和分离区域的比吸收率(SAR)来计算头部的暴露水平。与均匀模式比较,发现两种模式的总SAR大致相同,但非均匀模式在某些区域的SAR比均匀模式高10倍。这些发现表明,在同质模型的基础上评估SAR可能会导致误导性的结论。
RF receivers for airborne applications are critical systems for wireless signal reception and processing. Any unwanted interfering signals received by the receiver have a direct impact on the quality of the intended signals. The first paper, “Improved Complex Receiver System Design Strategies to Overcome EMI/EMC Challenges,” describes the strategies and implementation techniques for a complex receiver system design to meet environmental stress screening (ESS) requirements, especially EMC. The proposed design methodology segregates the various modules and stacks them together tactfully without compromising EMC. By applying these techniques, an actual design with four modules is demonstrated and tested for EMC compliance over an extreme temperature range from -40°C to +71°C.