VCMA-MRAM的偏移场控制

IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Nanotechnology Pub Date : 2023-09-07 DOI:10.1109/TNANO.2023.3312949
Robert Carpenter;Woojin Kim;Kiroubanand Sankaran;Mohamed Ben Chroud;Maxwel Gama Monteiro;Johan Swerts;Gouri Sankar Kar;Sebastien Couet
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引用次数: 0

摘要

电压控制磁各向异性-磁随机存取存储器(VCMA-MRAM)工业化的关键挑战之一是写入过程的可靠性。由于VCMA是一个非确定性写入过程,与其他MRAM技术相比,它对由硬层(HL)/参考层(RL)产生的杂散场引起的自由层(FL) ($\mu _{0}H_{off}$)的任何偏移都更敏感。本文演示了一种控制$\mu _{0}H_{off}$的简单方法。在典型的Co/Pt HL中,可以通过改变Co浓度和重复次数来调节HL和RL的相对矩。这种效果在薄膜和器件级得到了证明,其中FL偏移量为$\mu _{0}H_{off}=0$ mT,而任何其他器件属性的变化都很小。此外,在优化的器件中,开关概率分布相对于VCMA脉冲宽度是对称的。结果表明,通过简单的调谐,可以解决VCMA-MRAM的关键挑战之一。
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Offset Field Control for VCMA-MRAM
One of the key challenges in the industrialisation of Voltage Controlled Magnetic Anisotropy-Magnetic Random Access Memory (VCMA-MRAM) is the reliability of the writing process. As VCMA is a non-deterministic write process, it is more sensitive to any offset of the Free Layer (FL) ( $\mu _{0}H_{off}$ ) due to stray fields generated by the Hard Layer (HL)/Reference Layer (RL), as compared to alternative MRAM technologies. In this work, a simple method for the control of $\mu _{0}H_{off}$ is demonstrated. The relative moments of the HL and RL can be tuned by varying the Co concentration, and number of repeats, in a typical Co/Pt HL. The effect of this is demonstrated at thin film and device level where a FL offset of $\mu _{0}H_{off}=0$  mT is obtained, with minimal change in any other device properties. Furthermore, the switching probability distribution, with respect to VCMA pulse width, is shown to be symmetric in the optimised device. This result shows that with simple tuning, one of the key challenges to VCMA-MRAM can be solved.
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来源期刊
IEEE Transactions on Nanotechnology
IEEE Transactions on Nanotechnology 工程技术-材料科学:综合
CiteScore
4.80
自引率
8.30%
发文量
74
审稿时长
8.3 months
期刊介绍: The IEEE Transactions on Nanotechnology is devoted to the publication of manuscripts of archival value in the general area of nanotechnology, which is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.
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