无氟水溶液中银在硅表面的电沉积

S. Djokić, K. Cadien
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引用次数: 10

摘要

已经证明,在室温或高温下,从pH值高于12的含Ag(I)离子的无氟碱性溶液中直接沉积银到硅表面。这种沉积不需要还原剂,即通过电位移反应进行。并通过XRD和SEM对该工艺进行了实验验证。理论上,已证实该过程在室温下是热力学有利的,但对于实际工业应用,建议将温度升高(高达100◦C)。©作者2015。由ECS出版。这是一篇基于知识共享署名4.0许可(CC BY, http://creativecommons.org/licenses/by/4.0/)的开放获取文章,该许可允许在任何媒体上不受限制地重复使用该作品,前提是正确引用原始作品。[DOI: 10.1149/2.0051506]版权所有。
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Galvanic Deposition of Silver on Silicon Surfaces from Fluoride Free Aqueous Solutions
Direct deposition of silver from fluoride-free alkaline solutions containing Ag(I) ions at pH higher than 12 onto silicon surfaces at room or elevated temperatures has been demonstrated. This deposition does not require a reducing agent, i.e. process proceeds via galvanic displacement reactions. This new process that is based on strong alkaline and fluoride-free solutions was experimentally illustrated through XRD and SEM analyses. Theoretically, it was confirmed that this process is thermodynamically favorable at room temperature, however for the real industrial applications elevated temperatures (up to 100◦C) are recommended. © The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. [DOI: 10.1149/2.0051506eel] All rights reserved.
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来源期刊
ECS Electrochemistry Letters
ECS Electrochemistry Letters ELECTROCHEMISTRY-MATERIALS SCIENCE, MULTIDISCIPLINARY
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