Azmah Hasran, S. Kamarudin, B. Majlis, W. Daud, A. Kadhum, G. Sugandi
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引用次数: 0
摘要
采用基于微机电系统(MEMS)技术的微加工工艺制备了微燃料电池用硅极板。干式蚀刻工艺采用高稳定性Nd:YAG的激光烧蚀技术。该技术适用于硅基板的微加工。电极板总尺寸为2.5 cm × 2.5 cm,活性反应面积为1 cm。随着激光扫描次数的增加,被蚀刻在硅样品上的凹槽加深,但随着扫描次数的增加,它表现出饱和行为。激光刻蚀面积为0.185 cm × 0.185 cm的14个方形通孔的完整电极板流场所需时间约为30分钟,大大缩短了氢氧化钾溶液(KOH)溶液10小时以上的湿法刻蚀时间。激光蚀刻流场按照原始设计实现了垂直的侧壁,而湿蚀刻结构实现了典型的各向异性孔结构,由于硅片的取向,侧壁与电极表面的距离约为54度。因此,选择激光烧蚀技术生产微型燃料电池极板,与传统的KOH溶液湿法蚀刻工艺相比,激光烧蚀技术可以节省蚀刻过程的时间,并且可以获得更精确的极板流场尺寸,而且工艺步骤更少。
LASER-ASSISTED SILICON ETCHING FOR MICRO FUEL CELL ELECTRODE PLATE FABRICATION
Silicon electrode plates for micro fuel cells were obtained using a microfabrication process based on the micro-electromechanical system (MEMS) technology. The dry etching process involved the laser ablation technique using the highly stable Nd:YAG. This technique is suitable for micromachining silicon substrates. The total size of the electrode plate was 2.5 cm x 2.5 cm and the active reaction area was 1 cm. An increase in laser scan numbers deepened the groove being etched on the silicon sample, but it showed a saturated behavior as the number of scans became higher. The time required to etch a complete electrode plate flow field with 14 square-shaped through-holes of 0.185 cm x 0.185 cm area using laser ablation was ~30 minutes, which was much shorter than the wet etching time of more than 10 hours with the potassium hydroxide solution (KOH) solution. The laser-etched flow field achieved vertical sidewalls as per the original design, whereas the wet-etched structure achieved a typical anisotropic hole structure with sidewalls that were approximately 54o to the electrode surface due to the <100> orientation of the silicon wafer. Therefore, the laser ablation technique was chosen to produce the electrode plates for the micro fuel cell as it can save time on the etching process and produce more precise flow field dimensions for the electrode plates with less process steps compared with the conventional wet etching processes using KOH solution.