IEEE固态电路学会开放期刊基于薄膜晶体管的集成电路和系统专刊

Kris Myny
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摘要

如今,薄膜晶体管(TFT)作为各种显示器和成像器产品的背板技术无处不在。这些晶体管在有源矩阵液晶显示器(AM LCD)中充当开关,或者在有源矩阵有机发光二极管(AM OLED)面板中充当全像素引擎,包括驱动和阈值补偿。TFT制造只需要有限的光刻步骤,与传统的硅CMOS技术相比,这使其成为一种相对简单的晶体管技术。TFT技术的处理温度足够低,可以与玻璃兼容,甚至可以实现柔性基板。最后,这些晶体管是专门为大面积应用开发的,如电视和X射线扫描仪。因此,TFT的背板尺寸已从270毫米乘360毫米的第1代玻璃面板发展到第10.5代,后者是在294百万美元乘3.37百万美元的玻璃面板上制造的[1]。这与目前在200毫米或300毫米圆形晶片上制造的传统硅CMOS集成电路有着深刻的不同。在生产中,TFT技术在玻璃或柔性基板上的关键尺寸在几微米的范围内。TFT在显示领域的研究重点是实现越来越高的像素分辨率、提高的视觉质量、用于LED墙的更大面板、柔性显示器、后置摄像头、传感器集成等。
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IEEE Open Journal of the Solid-State Circuits Society Special Section on Integrated Circuits and Systems Based on Thin-Film Transistors
Thin-Film transistors (TFTs) are ubiquitous today as a backplane technology for various display and imager products. Those transistors act as switches in active-matrix liquid-crystal displays (AM-LCDs) or as full-pixel engines, including driving and threshold compensation, in active-matrix organic light-emitting diodes (AM-OLEDs) panels. TFT manufacturing requires only a limited amount of photolithographic steps, making it a relatively simple transistor technology, compared to the traditional Si CMOS technologies. The processing temperature of TFT technologies is sufficiently low to be compatible with glass and can even enable flexible substrates. Finally, these transistors have been developed specifically for large-area applications, such as televisions and X-ray scanners. Consequently, the backplane size for TFTs has evolved from the generation-1 glass panel of 270 mm by 360 mm to generation-10.5, which is manufactured on a glass panel of 2.94 m $\times3.37$ m [1] . This is profoundly different from traditional Si CMOS integrated circuits, which are fabricated nowadays on 200 mm or 300 mm round wafers. The critical dimension of the TFT technology on glass or flexible substrate in production is in the range of a few micrometers. The TFT research in the display field focuses on enabling increasingly better pixel resolution, improved visual quality, larger panels for LED walls, flexible displays, camera-behind display, sensor integration, and many more.
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