Pub Date : 2026-01-26DOI: 10.1109/OJSSCS.2026.3652568
Woogeun Rhee
{"title":"New Associate Editors","authors":"Woogeun Rhee","doi":"10.1109/OJSSCS.2026.3652568","DOIUrl":"https://doi.org/10.1109/OJSSCS.2026.3652568","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"6 ","pages":"1-2"},"PeriodicalIF":3.2,"publicationDate":"2026-01-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11363466","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146082132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-26DOI: 10.1109/OJSSCS.2026.3658141
{"title":"2025 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 5","authors":"","doi":"10.1109/OJSSCS.2026.3658141","DOIUrl":"https://doi.org/10.1109/OJSSCS.2026.3658141","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"524-537"},"PeriodicalIF":3.2,"publicationDate":"2026-01-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11364040","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146082098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-21DOI: 10.1109/OJSSCS.2025.3643485
Po-Chiun Huang;Pieter Harpe
{"title":"Special Section on Temperature Resilient Systems and Circuits","authors":"Po-Chiun Huang;Pieter Harpe","doi":"10.1109/OJSSCS.2025.3643485","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3643485","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"454-455"},"PeriodicalIF":3.2,"publicationDate":"2026-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11360104","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146026551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-21DOI: 10.1109/OJSSCS.2025.3648687
Inhee Lee;Phillip Nadeau
{"title":"Special Section on Energy-Efficient Biomedical Systems and Circuits","authors":"Inhee Lee;Phillip Nadeau","doi":"10.1109/OJSSCS.2025.3648687","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3648687","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"322-323"},"PeriodicalIF":3.2,"publicationDate":"2026-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11360106","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146026496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-21DOI: 10.1109/OJSSCS.2025.3640567
Shenggao Li;Tony Chan Carusone
{"title":"Special Section on Chiplet Interconnects and Architectures","authors":"Shenggao Li;Tony Chan Carusone","doi":"10.1109/OJSSCS.2025.3640567","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3640567","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"400-400"},"PeriodicalIF":3.2,"publicationDate":"2026-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11360105","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146026632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-15DOI: 10.1109/OJSSCS.2026.3652648
{"title":"IEEE Open Journal of the Solid-State Circuits Society","authors":"","doi":"10.1109/OJSSCS.2026.3652648","DOIUrl":"https://doi.org/10.1109/OJSSCS.2026.3652648","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"6 ","pages":"C2-C2"},"PeriodicalIF":3.2,"publicationDate":"2026-01-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11355752","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145969436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-12DOI: 10.1109/OJSSCS.2026.3652562
Noriyuki Miura
An integrated sense-and-react countermeasure constitutes a promising hardware-security approach to mitigate malicious physical attacks targeting resource-constrained yet security-critical information systems. An integrated physical-attack sensor detects, in situ, the potential risk of information leakage, and upon detection, an integrated reaction circuit autonomously responds by immediately disabling the attack to protect secret information. To reduce hardware overhead, the sensor and reaction circuits are specifically tailored to the assumed attack surfaces, scenarios, and required security levels. This article presents compact, low-power integrated sensors, and reaction circuits designed to counter both passive side-channel and active fault-injection attacks, such as those exploiting power traces, electromagnetic radiation, and laser-induced faults. Silicon prototypes validate the proposed approach by demonstrating comprehensive attack detection and effective risk mitigation of information leakage, achieved with limited hardware cost, thereby enabling practical deployment in resource-constrained security systems.
{"title":"Integrated Sense-and-React Countermeasures Against Physical Attacks on Resource-Constrained Security Systems","authors":"Noriyuki Miura","doi":"10.1109/OJSSCS.2026.3652562","DOIUrl":"https://doi.org/10.1109/OJSSCS.2026.3652562","url":null,"abstract":"An integrated sense-and-react countermeasure constitutes a promising hardware-security approach to mitigate malicious physical attacks targeting resource-constrained yet security-critical information systems. An integrated physical-attack sensor detects, in situ, the potential risk of information leakage, and upon detection, an integrated reaction circuit autonomously responds by immediately disabling the attack to protect secret information. To reduce hardware overhead, the sensor and reaction circuits are specifically tailored to the assumed attack surfaces, scenarios, and required security levels. This article presents compact, low-power integrated sensors, and reaction circuits designed to counter both passive side-channel and active fault-injection attacks, such as those exploiting power traces, electromagnetic radiation, and laser-induced faults. Silicon prototypes validate the proposed approach by demonstrating comprehensive attack detection and effective risk mitigation of information leakage, achieved with limited hardware cost, thereby enabling practical deployment in resource-constrained security systems.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"6 ","pages":"15-24"},"PeriodicalIF":3.2,"publicationDate":"2026-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11345479","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146082056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This article presents a review on energy-efficient circuits optimized for single-photon avalanche diodes (SPADs) in medical imaging applications. SPADs enable single-photon detection capability and subnanosecond timing precision, making them highly suitable for various medical applications, such as X-ray imaging, positron emission tomography (PET), and fluorescence lifetime imaging microscopy (FLIM). However, large-area SPAD-based imagers, particularly wafer-scale X-ray detectors, face challenging energy-efficiency requirements, as millions of pixels operate concurrently at high bias voltages above the breakdown voltage, leading to significant power consumption and thermal management requirements. This review highlights various SPAD structures across different fabrication processes, such as frontside illumination (FSI) process, and backside illumination (BSI) process. It also summarizes recent advances in pixel-level front-end circuits that manage the recharge of the SPAD while minimizing power consumption. Furthermore, optimized counter architectures for the SPAD pixel are discussed, with emphasis on extrapolation-based techniques that extend the dynamic range while reducing the overall power consumption of the SPAD-based detectors. By combining these techniques, energy-efficient SPAD-based detectors for medical imaging applications can be realized, where compact integration, thermal management, and patient safety are critical.
{"title":"Review of Energy Efficient Circuits Optimized for Single-Photon Avalanche Diodes in Medical Imaging Applications","authors":"Byungchoul Park;Hyun-Seung Choi;Dongseok Cho;Hyo-Sung Park;Myung-Jae Lee;Youngcheol Chae","doi":"10.1109/OJSSCS.2025.3648964","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3648964","url":null,"abstract":"This article presents a review on energy-efficient circuits optimized for single-photon avalanche diodes (SPADs) in medical imaging applications. SPADs enable single-photon detection capability and subnanosecond timing precision, making them highly suitable for various medical applications, such as X-ray imaging, positron emission tomography (PET), and fluorescence lifetime imaging microscopy (FLIM). However, large-area SPAD-based imagers, particularly wafer-scale X-ray detectors, face challenging energy-efficiency requirements, as millions of pixels operate concurrently at high bias voltages above the breakdown voltage, leading to significant power consumption and thermal management requirements. This review highlights various SPAD structures across different fabrication processes, such as frontside illumination (FSI) process, and backside illumination (BSI) process. It also summarizes recent advances in pixel-level front-end circuits that manage the recharge of the SPAD while minimizing power consumption. Furthermore, optimized counter architectures for the SPAD pixel are discussed, with emphasis on extrapolation-based techniques that extend the dynamic range while reducing the overall power consumption of the SPAD-based detectors. By combining these techniques, energy-efficient SPAD-based detectors for medical imaging applications can be realized, where compact integration, thermal management, and patient safety are critical.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"511-523"},"PeriodicalIF":3.2,"publicationDate":"2025-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11316338","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146026600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-19DOI: 10.1109/OJSSCS.2025.3646593
Tuna B. Tufan;Benjamin Larkin;John McNeill;Ulkuhan Guler
Continuous monitoring of arterial carbon dioxide is critical for assessing respiratory function and detecting ventilation inefficiencies. Arterial blood gas analysis, the clinical gold standard, is invasive and limited to intermittent measurements in hospital settings. Transcutaneous carbon dioxide sensing offers a noninvasive alternative by measuring carbon dioxide diffusing through the skin, which strongly correlates with arterial carbon dioxide. However, conventional transcutaneous sensors require bulky bedside monitors and heating elements, making them unsuitable for wearable applications. This work presents the first integrated circuit implementation of a ratiometric time-domain dual lifetime referencing technique using a direct current-to-digital converter architecture designed for energy-efficient wearables. The proposed design achieves 0.15-nA/cnt resolution over a 30-$mu $ A input range at 88-$mu $ W power consumption. With the proposed I-DAC current-scaling technique, the system maintains a luminescence ratio error of $le 0.5$ % across a wide input range.
持续监测动脉二氧化碳对于评估呼吸功能和发现通气效率低下至关重要。动脉血气分析是临床金标准，是侵入性的，仅限于医院环境中的间歇性测量。经皮二氧化碳传感提供了一种无创的替代方法，通过测量通过皮肤扩散的二氧化碳，这与动脉二氧化碳密切相关。然而，传统的经皮传感器需要笨重的床边监视器和加热元件，这使得它们不适合可穿戴应用。这项工作提出了使用专为节能可穿戴设备设计的直流数字转换器架构的比率时域双寿命参考技术的第一个集成电路实现。该设计在30- $mu $ a的输入范围内实现了0.15 na /cnt的分辨率，功耗为88- $mu $ W。采用本文提出的I-DAC电流标度技术，系统的发光比误差保持在 $le 0.5$ % across a wide input range.
{"title":"A Direct Current-to-Digital Converter IC for Luminescence-Based Detection Toward an Energy Efficient Transcutaneous Carbon Dioxide Sensor Wearable","authors":"Tuna B. Tufan;Benjamin Larkin;John McNeill;Ulkuhan Guler","doi":"10.1109/OJSSCS.2025.3646593","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3646593","url":null,"abstract":"Continuous monitoring of arterial carbon dioxide is critical for assessing respiratory function and detecting ventilation inefficiencies. Arterial blood gas analysis, the clinical gold standard, is invasive and limited to intermittent measurements in hospital settings. Transcutaneous carbon dioxide sensing offers a noninvasive alternative by measuring carbon dioxide diffusing through the skin, which strongly correlates with arterial carbon dioxide. However, conventional transcutaneous sensors require bulky bedside monitors and heating elements, making them unsuitable for wearable applications. This work presents the first integrated circuit implementation of a ratiometric time-domain dual lifetime referencing technique using a direct current-to-digital converter architecture designed for energy-efficient wearables. The proposed design achieves 0.15-nA/cnt resolution over a 30-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>A input range at 88-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>W power consumption. With the proposed I-DAC current-scaling technique, the system maintains a luminescence ratio error of <inline-formula> <tex-math>$le 0.5$ </tex-math></inline-formula>% across a wide input range.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"388-399"},"PeriodicalIF":3.2,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11304713","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146026533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-15DOI: 10.1109/OJSSCS.2025.3644337
Ratul Das;Hanh-Phuc Le
This work presents a shared-switched-capacitor multioutput hybrid (SSC-MoH) converter to support large conversion ratios from a 12–24 V input to three separate outputs of 0.8–1.8 V. The 6-switch converter includes a 3X-step-down switched capacitor (SC) front-end that is fully soft-charged and shared by three output inductors. The output voltages are individually regulated using PWM signals from a power-collaborative control (PCC). The chip was manufactured in a 130-nm high-voltage BCD process, achieving a peak efficiency of 87.14%, 30X conversion ratio, and 11.93-W peak output power in system evaluation.
{"title":"Shared Switched Capacitor Multioutput Hybrid Converter for High Conversion Ratio Applications","authors":"Ratul Das;Hanh-Phuc Le","doi":"10.1109/OJSSCS.2025.3644337","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3644337","url":null,"abstract":"This work presents a shared-switched-capacitor multioutput hybrid (SSC-MoH) converter to support large conversion ratios from a 12–24 V input to three separate outputs of 0.8–1.8 V. The 6-switch converter includes a 3X-step-down switched capacitor (SC) front-end that is fully soft-charged and shared by three output inductors. The output voltages are individually regulated using PWM signals from a power-collaborative control (PCC). The chip was manufactured in a 130-nm high-voltage BCD process, achieving a peak efficiency of 87.14%, 30X conversion ratio, and 11.93-W peak output power in system evaluation.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"6 ","pages":"3-14"},"PeriodicalIF":3.2,"publicationDate":"2025-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11300850","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146082147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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