集成硅通孔与无焊,兼容的互连为新颖的,大面积的中间层

I. Shubin, E. Chow, A. Chow, H. Thacker, D. Debruyker, K. Fujimoto, K. Raj, A. Krishnamoorthy, J. Mitchell, J. Cunningham
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引用次数: 3

摘要

介绍了一种新型封装模块,该封装模块将带有硅铜通孔(tsv)的柔性微弹簧互连协整成无源大面积硅中间层。我们报告了基于这种中间体的封装测试车辆,旨在展示晶圆级集成过程,以形成高成品率和低电阻的TSV+弹簧互连。我们的目标是开发一个可扩展的,大面积的芯片或MCM封装平台,使具有不同功能和技术的芯片和组件的无压力,易于重新组装。我们展示了中间层布局,分享了过程细节和表征方法。
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Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers
A novel packaging module is described that is based on co-integration of flexible micro-spring interconnects with through silicon copper vias (TSVs) into a passive large area silicon interposer. We report on the packaging test vehicles based on such interposers that are designed to demonstrate a wafer scale integration process to form TSV+spring interconnects with high yield and low resistance. Our goal is to develop a scalable, large area die or MCM packaging platform to enable stress-free, readily reworkable packaging of chips and components with different functionality and technology. We show interposer layouts, share process details and characterization methods.
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Parasitic electrical and electromagnetic effects Heat management Passive electronic components Interconnection technology Reliability and maintainability
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