硅表面的热氧化物、Al2O3和非晶硅钝化层

W. Ho, Y.-Y. Chen, T.-H. Cheng, Jyun-Yan Chen, J.-A. Lu, P. Huang, C. W. Liu
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引用次数: 2

摘要

有效钝化需要(1)具有比Si更高的带隙(1型排列),(2)钝化层与Si界面处的界面密度低,(3)场效应钝化需要电离电荷。具有低界面缺陷密度的热氧化物(SiO2)似乎是最有效的,但需要较高的生长温度(900℃)。带固定负电荷的Al2O3可以起到场效应钝化作用。此外,在控制电离电荷密度的情况下,掺杂的非晶硅还可以发生场效应钝化。利用准稳态光电导(QSSPC)测量了有效寿命。光致发光(PL)测量与QSSPC一致,在大样本上可以探测局部区域,具有制图能力。从理论上研究了PL强度与表面复合速度的关系。在高温退火结晶后,a-Si的钝化效果变差,表明需要较大的带隙。
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Thermal oxide, Al2O3 and amorphous-Si passivation layers on silicon
The effective passivation needs (1) higher bandgap than Si with type 1 alignment, (2) low interface density at the interface between passivation layer and Si, and (3) ionized charges for field effect passivation. The thermal oxide (SiO2) with low interface defect density seems most effective but requires high growth temperature (900 °C). Al2O3 with trapped negative fixed charges can serve as the field effect passivation. Moreover, doped amorphous Si can also have the field effect passivation with the controlled ionized charge density. The effective life time is measured by quasi-steady-state photoconductance (QSSPC). Photoluminescence (PL) measurement is consistent with QSSPC, and can probe a local area with mapping ability on large samples. The dependence of PL intensity on surface recombination velocity is theoretically studied. The passivation of a-Si becomes less effective after crystallization at high temperature annealing, indicating the larger bandgap is necessary.
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