具有布局约束意识的3D多核处理器的带宽可扩展光学层设计

L. Ramini, D. Bertozzi, L. Carloni
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引用次数: 32

摘要

未来芯片多处理器的性能只有在内存访问效率相应提高的情况下,才会随着集成内核数量的增加而扩大。本文的重点是用于高带宽和低延迟处理器-存储器通信的3d堆叠波长路由光层,并补充了正在进行的光子集成带宽丰富的DRAM设备的工作。这种目标环境决定了布局约束,使得区分不同的光学层设计选择有所不同。本文评估了具有深度技术和布局意识的网络划分选项和带宽可扩展性技术,主要贡献在于表征和精确量化无源光学NoC的技术平台、布局约束和网络级质量指标之间的相互作用效应。
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Engineering a Bandwidth-Scalable Optical Layer for a 3D Multi-core Processor with Awareness of Layout Constraints
The performance of future chip multi-processors will only scale with the number of integrated cores if there is a corresponding increase in memory access efficiency. The focus of this paper on a 3D-stacked wavelength-routed optical layer for high bandwidth and low latency processor-memory communication goes in this direction and complements ongoing efforts on photonically integrated bandwidth-rich DRAM devices. This target environment dictates layout constraints that make the difference in discriminating between alternative design choices of the optical layer. This paper assesses network partitioning options and bandwidth scalability techniques with deep technology and layout awareness, the main contribution lying in the characterization and precise quantification of such interaction effects between the technology platform, the layout constraints and the network-level quality metrics of a passive optical NoC.
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Analytical Performance Modeling of Hierarchical Interconnect Fabrics Fine-Grained Bandwidth Adaptivity in Networks-on-Chip Using Bidirectional Channels Engineering a Bandwidth-Scalable Optical Layer for a 3D Multi-core Processor with Awareness of Layout Constraints An Optimal Control Approach to Power Management for Multi-Voltage and Frequency Islands Multiprocessor Platforms under Highly Variable Workloads A Statically Scheduled Time-Division-Multiplexed Network-on-Chip for Real-Time Systems
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