{"title":"电子封装技术更新:BGA, CSP, DCA和倒装芯片","authors":"J. Lau","doi":"10.1108/03056129710370277","DOIUrl":null,"url":null,"abstract":"The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.","PeriodicalId":13256,"journal":{"name":"IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]","volume":"36 1","pages":"32-36"},"PeriodicalIF":0.0000,"publicationDate":"1997-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Electronics Packaging Technology Update: BGA, CSP, DCA, And Flip Chip\",\"authors\":\"J. Lau\",\"doi\":\"10.1108/03056129710370277\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.\",\"PeriodicalId\":13256,\"journal\":{\"name\":\"IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]\",\"volume\":\"36 1\",\"pages\":\"32-36\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1108/03056129710370277\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1108/03056129710370277","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electronics Packaging Technology Update: BGA, CSP, DCA, And Flip Chip
The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.
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