High-density hall grid array (BGA) substrates were developed using laser technologies High-energy, short-pulse COz laser was found to be a high-quality, cost-competitive source of processing organic materials. Either a polyimide film oi an aramid-based laminate was used to form advanced BGAs with no through-holes that had been a cause of poor moisture resistance It was found that the tape BGA has sutfcient coplanarity and thinner, lighter features than conventional PBGAs, and also has much higher I-eliability. Independent double-sided traces were obtained using double-sided polyimide tape and processing by a laser to get bonding shelves and ball pads, and an extremely high pin count was obtained When the laser drilling, technology was applied for a double-sided aramid-based laminate, a flip-chip, chip-scale package (CSP) with nonsoldermask-defined ball pads was obtained For multilayer BGA with bonding shelves, the laser was used to forin multiple-tier bonding shelves using an aramid-based laminate The multilayeiboard was attached to a heat slug to form a cavity-down BGA
{"title":"High Density Bga Substrates Fabricated By Laser Technologies","authors":"T. Hirakawa, F. Sato","doi":"10.5104/JIEP.1.410","DOIUrl":"https://doi.org/10.5104/JIEP.1.410","url":null,"abstract":"High-density hall grid array (BGA) substrates were developed using laser technologies High-energy, short-pulse COz laser was found to be a high-quality, cost-competitive source of processing organic materials. Either a polyimide film oi an aramid-based laminate was used to form advanced BGAs with no through-holes that had been a cause of poor moisture resistance It was found that the tape BGA has sutfcient coplanarity and thinner, lighter features than conventional PBGAs, and also has much higher I-eliability. Independent double-sided traces were obtained using double-sided polyimide tape and processing by a laser to get bonding shelves and ball pads, and an extremely high pin count was obtained When the laser drilling, technology was applied for a double-sided aramid-based laminate, a flip-chip, chip-scale package (CSP) with nonsoldermask-defined ball pads was obtained For multilayer BGA with bonding shelves, the laser was used to forin multiple-tier bonding shelves using an aramid-based laminate The multilayeiboard was attached to a heat slug to form a cavity-down BGA","PeriodicalId":13256,"journal":{"name":"IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]","volume":"18 1","pages":"295-298"},"PeriodicalIF":0.0,"publicationDate":"1997-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75413155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-04-16DOI: 10.1108/03056129710370277
J. Lau
The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.
{"title":"Electronics Packaging Technology Update: BGA, CSP, DCA, And Flip Chip","authors":"J. Lau","doi":"10.1108/03056129710370277","DOIUrl":"https://doi.org/10.1108/03056129710370277","url":null,"abstract":"The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.","PeriodicalId":13256,"journal":{"name":"IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]","volume":"36 1","pages":"32-36"},"PeriodicalIF":0.0,"publicationDate":"1997-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73877123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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