Chi‐Feng Chen, Guo-Yun Wang, Bo-Hao Tseng, Ting Lin
{"title":"系统级封装应用的紧凑型微波双工器设计","authors":"Chi‐Feng Chen, Guo-Yun Wang, Bo-Hao Tseng, Ting Lin","doi":"10.1109/ICCE-TW.2016.7520955","DOIUrl":null,"url":null,"abstract":"A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 λg by 0.12 λg. The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.","PeriodicalId":6620,"journal":{"name":"2016 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)","volume":"31 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Design of compact microwave diplexer for system-in-a-package applications\",\"authors\":\"Chi‐Feng Chen, Guo-Yun Wang, Bo-Hao Tseng, Ting Lin\",\"doi\":\"10.1109/ICCE-TW.2016.7520955\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 λg by 0.12 λg. The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.\",\"PeriodicalId\":6620,\"journal\":{\"name\":\"2016 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)\",\"volume\":\"31 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCE-TW.2016.7520955\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCE-TW.2016.7520955","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of compact microwave diplexer for system-in-a-package applications
A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 λg by 0.12 λg. The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.