聚碳酸酯的热物理行为:在玻璃化转变温度上下自由淬火的影响

Brahim Barka, F. Rouabah, Fairouz Zouaoui, M. Fois, Y. Nouar, A. Bencid
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引用次数: 0

摘要

聚碳酸酯是一种坚韧、无定形、透明的高性能热塑性聚合物。由于其多功能的热物理、机械和光学特性,它被用于许多应用领域。然而,它的缺点之一是其相对较高的导热性,这阻碍了它作为绝缘材料的应用。因此,适当的热处理是提高隔热性能的有效途径。本工作的目的是研究热处理的效果;即高于和低于玻璃化转变温度(Tg)的淬火温度对纯聚碳酸酯(PC)热物理性能的影响。研究了Tg以上淬火温度对纯聚甲基丙烯酸甲酯(PMMA)的影响。研究了自由淬火过程中产生的残余应力对纯PC热物理性能的影响。采用周期性测量法(DICO)测量了室温下纯PC的导热系数(k)和热扩散系数(a)。在CERTES实验室(巴黎第12大学热、环境和系统研究中心)开发的DICO方法可以同时获得电导率和热扩散率,从而可以推断出比热(Cp)。研究表明,Tg以上的高温淬火对PC和PMMA的导热性和热扩散率没有影响。然而,在低于Tg(130℃)的温度下淬火,两者的热性能都有所下降。实际上,130℃退火PC的导热系数为0.22 w - m-1 . k -1,在0℃和40℃淬火后分别降至0.06 w - m-1 . k -1和0.14 w - m-1 . k -1。这意味着与只经过退火处理的材料相比,淬火可以提高PC的绝缘能力。与导热系数相反,在此温度范围内(0°C - 40°C)的比热容值由于淬火而显著增加。它们从1118 J. kg-1增加。K-1为1290 J. kg-1。0°C淬火PC的K-1,增加到2221 J. kg-1。在40°C淬火时,PC的K-1对应提高了98%。还发现,热导率和比热值与文献报道的纯PC样品在Tg以下淬火时的值一致。
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Thermophysical Behavior of Polycarbonate: Effect of Free Quenching above and below the Glass Transition Temperature
Polycarbonate is a tough, amorphous and transparent high performance thermoplastic polymer. It is used in many fields of application due to its versatile thermophysical, mechanical and optical properties. However, one of its drawbacks is its relatively high thermal conductivity which prevents its application as an insulating material. An appropriate heat treatment can therefore be a useful route to improve the thermal insulating property. The objective of this work is to study the effect of heat treatment; namely the influence of the quenching temperature above and below the glass transition temperature (Tg) on the thermophysical properties of neat polycarbonate (PC). The effect of the quenching temperature above Tg was also studied for neat poly (methyl methacrylate) (PMMA). The effect of residual stresses (RS) generated by the free quenching process on the thermophysical properties of neat PC was investigated. The thermal conductivity (k) and thermal diffusivity (a) of neat PC were measured using a periodic measurement method (DICO), (DIffusivity and COnductivity), at room temperature. The DICO method developed in the CERTES laboratory (Center for Studies and Research in Thermal, Environment and Systems of Paris 12 University), allows simultaneous access to the conductivity and thermal diffusivity from which the specific heat (Cp) can then be deduced. This work showed that the quenching from a high temperature above Tg did not affect the thermal conductivity and thermal diffusivity of both PC and PMMA. However, quenching from a temperature below Tg (130 ° C) caused a decrease of both the thermal. In fact the thermal conductivity of PC annealed at 130 ° C which is 0.22 W. m-1 .K-1 decreased to 0.06 W. m-1 .K-1 and 0.14 W. m-1 .K-1 after quenching at 0° C and 40 ° C respectively. This means that quenching would therefore improve the insulating capacity of PC compared to the material which has undergone only annealing. Contrary to the thermal conductivity, the values of the specific heat capacity in this temperature range ( 0° C – 40° C) significantly increased as a result of quenching. They increase from 1118 J. kg-1. K-1 for the annealed sample to 1290 J. kg-1. K-1 for PC quenched at 0° C and increased to 2221 J. kg-1. K-1 for PC quenched at 40 ° C which corresponds to an increase by 98 %. It was also found that the values of thermal conductivity and specific heat were in good agreement with those reported in the literature for neat PC samples quenched below Tg.
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