一维分子组装对介孔二氧化硅纳米通道中自修复能力的加热效应

Hendrik Oktendy Lintang, K. Kinbara, T. Yamashita, T. Aida
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引用次数: 6

摘要

热致结构损伤的自修复光电器件对于传感器[1]和显示器[2]的应用具有潜在的重要意义。最近,自修复现象在可持续结构材料的开发中引起了特别的关注[3],其中大量研究报道了能够自主修复宏观骨折或恢复失去的机械强度的聚合物材料[4,5]。另一方面,为了开发能够自我修复复杂功能的分子装置,人们可能会遇到来自更小尺寸体系的不同问题。然而,目前还没有提出合理的策略来解决这一具有挑战性的问题。在我们之前的论文中,当三核金(I)吡唑酸配合物[Au3Pz3]的磷光柱状组装体被限制在六方中孔二氧化硅[Au3Pz3]/硅己烯的纳米通道中(图1),在45分钟内从20°C逐步加热到140°C时,一维分子组装体不仅不受热破坏,而且强烈鼓励在5小时内从热引起的结构损伤中自我恢复到100%[6]。
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Heating effect of a one-dimensional molecular assembly on self-repairing capability in the nanoscopic channels of mesoporous silica
Self-repairable optoelectronic devices from a heat-induced structural damaged are potentially important for sensor [1] and display [2] applications. Recently, self-healing phenomena have attracted particular attention for developing sustainable structural materials [3], where extensive studies have been reported on polymeric materials capable of autonomous repairing macroscopic fractures or restoration lost mechanical strengths [4, 5]. On the other hand, for exploiting molecular devices that can self-repair elaborate functions, one may encounter different problems originating from much smaller size regimes. However, no rational strategies have yet been proposed for addressing this challenging issue. In our previous paper, when a phosphorescent columnar assembly of trinuclear gold(I) pyrazolate complex [Au3Pz3] is confined in the nanoscopic channel of hexagonal mesoporous silica [Au3Pz3]/silicahex (Fig. 1), upon stepwise heating from 20 °C to 140 °C in 45 min, the one-dimensional molecular assemblies are not only protected from thermal disruption but also strongly encouraged to self-recover to 100% in 5 h from a heat-induced structural damaged [6].
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