GF(2m)上交错乘法的低空间位串行收缩阵列结构

IF 1.1 4区计算机科学 Q4 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IET Computers and Digital Techniques Pub Date : 2021-03-10 DOI:10.1049/cdt2.12026

Atef Ibrahim

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引用次数: 2

摘要

本文提出了一种新的位串行收缩数组结构来实现二进制扩展域中的交错乘法算法。所展示的乘法器结构更适合VLSI的实现，因为它具有规则的单元结构以及单元之间的本地通信线路。建议的位串行乘法器结构和先前文献中描述的现有竞争性位串行乘法器结构的ASIC实现结果表明，推荐的设计分别显著减少了面积和显著提高了面积-时间复杂度，分别至少减少了28.4%和35.7%。因此，它更适合于对空间施加更多限制的加密应用程序。

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Low-space bit-serial systolic array architecture for interleaved multiplication over GF(2m)

This article offers a new bit-serial systolic array architecture to implement the interleaved multiplication algorithm in the binary-extended field. The exhibited multiplier structure is more proper for VLSI implementation as it has regular cell structures as well as local communication wires between the cells. The ASIC implementation results of the suggested bit-serial multiplier structure and the existing competitive bit-serial multiplier structures previously described in the literature indicate that the recommended design achieves a notable reduction in area and significant improvement of area-time complexities by at least 28.4% and 35.7%, respectively. Therefore, it is more proper for cryptographic applications forcing more restrictions on the space.

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来源期刊

IET Computers and Digital Techniques 工程技术-计算机：理论方法

CiteScore

3.50

自引率

0.00%

发文量

审稿时长

>12 weeks

期刊介绍： IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test. The key subject areas of interest are: Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation. Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance. Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues. Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware. Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting. Case Studies: emerging applications, applications in industrial designs, and design frameworks.