通过双晶片压电驱动器的宽范围二维InP芯片到光纤校准

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) Pub Date : 2018-08-07 DOI:10.1109/ECTC.2018.00172

S. Cardarelli, N. Calabretta, R. Stabile, K. Williams, Xiao Luo, J. Mink

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引用次数: 3

摘要

提出并演示了一种放松光电封装公差的方法，该方法使用低功耗、双晶圆、压电校准系统，该系统能够在100 μ m2的误差范围内补偿InP波导和透镜光纤之间的误差。这有望使使用宽松公差的拾取和放置工具。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators

A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 µm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

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2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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