{"title":"介电泳芯片三维电极的设计、仿真与制作","authors":"M. Singha, J. Nagaraju","doi":"10.1109/ISPTS.2015.7220110","DOIUrl":null,"url":null,"abstract":"This paper presents the design, simulation and fabrication of dielectrophoretic chip with integrated nickel 3D electrodes for bioparticle separation. Finite element analysis software COMSOL Multyphysics 4.3 is used to measure the electric field distribution and also the temperature profile inside the microfluidic channel. The temperature rise is found to be 0.5 K. Electric field distribution shows almost uniform electric field on XY plane at different Z axis. Fabrication of 3D nickel electrode is accomplished using electroplating process. 3D sidewall dielectrophoretic chip reduces the electrochemical effect and joule heating effect.","PeriodicalId":6520,"journal":{"name":"2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS)","volume":"3 1","pages":"192-195"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design simulation and fabrication of 3D electrode for dielectrophoretic chip\",\"authors\":\"M. Singha, J. Nagaraju\",\"doi\":\"10.1109/ISPTS.2015.7220110\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the design, simulation and fabrication of dielectrophoretic chip with integrated nickel 3D electrodes for bioparticle separation. Finite element analysis software COMSOL Multyphysics 4.3 is used to measure the electric field distribution and also the temperature profile inside the microfluidic channel. The temperature rise is found to be 0.5 K. Electric field distribution shows almost uniform electric field on XY plane at different Z axis. Fabrication of 3D nickel electrode is accomplished using electroplating process. 3D sidewall dielectrophoretic chip reduces the electrochemical effect and joule heating effect.\",\"PeriodicalId\":6520,\"journal\":{\"name\":\"2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS)\",\"volume\":\"3 1\",\"pages\":\"192-195\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPTS.2015.7220110\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPTS.2015.7220110","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design simulation and fabrication of 3D electrode for dielectrophoretic chip
This paper presents the design, simulation and fabrication of dielectrophoretic chip with integrated nickel 3D electrodes for bioparticle separation. Finite element analysis software COMSOL Multyphysics 4.3 is used to measure the electric field distribution and also the temperature profile inside the microfluidic channel. The temperature rise is found to be 0.5 K. Electric field distribution shows almost uniform electric field on XY plane at different Z axis. Fabrication of 3D nickel electrode is accomplished using electroplating process. 3D sidewall dielectrophoretic chip reduces the electrochemical effect and joule heating effect.
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