光学剪切法在电子器件分析中的应用

Y. F. López-Álvarez, F. Casillas-Rodriguez, F. G. Peña-Lecona, J. Munos-Maciel, M. E. Rodríguez-Franco, S. Orozco-Soto
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引用次数: 0

摘要

在材料表征中使用非破坏性方法进行物理变量估计,可以对研究对象施加外部激励力时的响应进行结构分析[1]。数字剪切术是一种光学工具,通过处理由相干光照射的物体在两种变形状态下的图像采集系统收集的信息来估计微变形[2]。该技术对环境干扰的敏感性低,在工业应用中具有许多优点。本文报道了一种用于电压调节的电子器件(LM7805CT)的机械响应分析结果。为了进行测试,在器件中施加偏置电压以达到最大功耗,使靠近输入引脚约6微米的变形表面局部化。此外,热像仪的使用表明,温度较高的区域对应于检测到的最大变形。
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Implementation of Optical Shearography for Electronic Devices Analysis
The use of non-destructive methods for physical variables estimation in materials characterization has allowed the structural analysis of response when an external excitation force is applied on a study object [1]. Digital shearography is an optical tool used to estimate micro-deformations by processing information collected with an image acquisition system of an object illuminated with coherent light for two deformation states [2]. This technique has many advantages in industrial applications due to its low sensibility to environmental disturbances. In this work are reported the results obtained in the mechanical response analysis of an electronic device used for voltage regulation (LM7805CT). For testing, a bias voltage was applied to reach maximum power dissipation in the device, localizing a deformation surface around six micrometers close to the input pin. Furthermore, the use of a thermal camera revealed that regions with higher temperature correspond to the maximum deformation detected.
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